Sansha Electric Manufacturing Company, Limited

Shuji Yokoyama

Masao Katooka

Kenzo Danjo

Hideo Ishii

Yoshimasa Kawashima

Hideo Isii

Masako Ikeda

Yumi Sato

A printed circuit board () includes an insulating substrate () on which conductive films () are formed. Semiconductor devices () disposed external to the printed circuit board () have their leads () connected to the conductive films. A flexible portion () is formed in the insulating substrate () at a location near the location where the leads () are connected to the conductive films ().

Heat sink arrangement for electrical apparatus

An attachment () for preventing a cover () from falling off from a housing () is provided. The cover () includes an elastic member () on each of the right and lefts ends thereof. The elastic members are made elastically deformable by forming slits () in the cover (). The elastic members () each have a protrusion (). In order to mount the cover () to the housing (), the protrusions () are inserted into respective ones of holes () formed in the housing () by inwardly deforming and, then, restoring the elastic members (). After mounting the cover () to the housing (), the cover falling-off preventing attachment () is attached to the cover (), with side walls 18 of the attachment () positioned to extend into the respective slits (), whereby the deformation of the elastic members () is prevented.

Attachment for preventing cover from falling off

A plasma arc utilizing apparatus includes a power supply unit disposed in a housing. The power supply unit converts an AC voltage to a DC voltage, which is applied to load for generating an arc therein. A compressor is disposed in the same housing for supplying the load with compressed gas that is to be ionized by the arc. The compressor has a leg by which the compressor is secured to the housing. The leg is embedded in an elastic material secured in the housing.

Plasma arc utilizing apparatus

Growing community of inventors

Osaka, Japan

Shuji Yokoyama