Stanley Electric Co., Ltd

Shuji Tanaka

Yoshiaki Yasuda

Mitsuyasu Kumagai

Hirofumi Chiba

Yukio Suzuki

Michio Kadota

A high-order mode surface acoustic wave device includes a piezoelectric substrate () formed from a LiTaOor LiNbOcrystal and an interdigital transducer electrode () embedded in a surface of the piezoelectric substrate () to use a surface acoustic wave in a high-order mode. Further, the high-order mode surface acoustic wave device may include a film () or substrate stacked on the piezoelectric substrate (), and may include a support substrate () and/or a multi-layer film () provided in contact with a surface opposite to the surface of the piezoelectric substrate () on which the interdigital transducer electrode () is provided. The high-order mode surface acoustic wave device may achieve good characteristics and maintain a sufficient mechanical strength even in a high frequency band of 3.8 GHz or greater.

High-order mode surface acoustic wave devices

In a light emitting device, in a bottom surface of a cavity of a Si substrate, slit-shaped through holes and through electrodes that fill the through holes are provided at a position facing a first element electrode of a light emitting element. A length of an upper surface of the through electrode in a long axis direction is larger than a height of the through electrode in a thickness direction of the Si substrate. A joining layer having a shape corresponding to a shape of the upper surface of the through electrode is disposed between the first element electrode of the light emitting element and the upper surface of the through electrode facing the first element electrode. The entire upper surface of the through electrode is joined to the first element electrode via the joining layer.

Growing community of inventors

Miyagi, Japan

Shuji Tanaka