Fujitsu Corporation

Shuji Takeshita

Yuichi Sato

Hiroshi Ikeda

Masayoshi Hashima

A computer executable three-dimensional device simulation program product for the purpose of making a three-dimensional device simulation system which generates a three-dimensional model of a device by using a mask data performing the procedures of inputting cross-sectional feature information indicating a cross-sectional feature of an edge part of a mask, and calculating the three-dimensional model based on the mask data and input cross-sectional feature information, thereby enabling an easy generation of a complex three-dimensional feature by using pattern forming-use mask data when generating a three-dimensional feature model of a minute device.

Computer-readable non-transitory medium storing three-dimensional device simulation program and three-dimensional device simulation system

A thin film circuit substrate comprising multilayer conductor layers formed via insulating layers, wherein a signal transmission path in at least one of the conductor layers is embedded in a low dielectric constant insulator, and the low dielectric constant insulator is embedded in an insulator layer with a good adhesiveness. The thin film circuit substrate attains a low dielectric constant, and thus an improved signal propagation velocity, without lowering the interlayer adhesiveness.

Thin film circuit substrate and process for the manufacture thereof

A method of exposing a photoresist layer deposited on a substrate uses an exposure mask having transparent and opaque regions defined on a mask substrate and a transition region defined on said mask substrate between said transparent region and said opaque region. The transition region comprises a plurality of opaque patterns having respective sizes and disposed with respective mutual separations such that said transmission region has a gradually increasing transmittance proceeding from said opaque region to said transparent region. The exposed photoresist layer is developed to form a resist pattern and the resist pattern is converted into an insulation pattern by conducting a baking process.

Process for manufacturing a printed circuit board using a mask with

An exposure mask includes a transparent region and an opaque region defined on a transparent substrate, with a transition region formed between he transparent region and the opaque region by a plurality of opaque patterns disposed with respective sizes and respective mutual separations changed gradually and continuously from the opaque region toward the transparent region, such that exposure dose increases gradually and consecutively from the opaque region toward the transparent region.

Mask with gradual increase in transmittance from opaque to transparent

A process for manufacturing a thin film circuit board includes forming an insulator layer having a relatively high etching rate in a desired thickness on an insulator layer having a relatively low etching rate and a relatively high dielectric constant, arranging a conductor layer on the insulator layer having a relatively high etching rate, selectively removing the insulator having a relatively high etching rate by etching but excluding a portion located beneath the conductor layer, forming an insulator portion that contains the insulator layer having a relatively high etching rate and supports the conductor layer in the undercut state, forming an insulator layer having a relatively low dielectric constant so as to surround the entire conductor layer, and forming an insulator layer having a relatively high dielectric constant on top of the insulator layer having a relatively low dielectric constant so as to surround the entire insulator layer having a relatively low dielectric constant.

Thin film circuit board manufacturing process

A thin film circuit board has an insulator layer and a conductor layer embedded in the insulator layer and supported in an undercut state by an insulator. The entire conductor layer, excluding the portion supported by the insulator, is surrounded by an insulator having a relatively low dielectric constant which in turn is surrounded by an insulator having a relatively high dielectric constant. The insulator portion that supports the conductor layer in the undercut state has a relatively high etching rate and is formed in a desired thickness on an insulator layer having a relatively low etching rate.

Thin film circuit board and its manufacturing process

A TV camera for visually inspecting an object is focused to a designated inspecting point, while being shifted to that inspecting point by utilizing a calculated distance from the TV camera to the next inspecting point without actually measuring the distance. The distance to the next inspecting point is calculated from a plane equation several of triangular planes formed over the object by a plurality of reference points previously designated on the object. The plane equations are calculated before executing inspection, by using distances, actually measured by distance measuring means, from the TV camera to the reference points.

Growing community of inventors

Kawasaki, Japan

Shuji Takeshita