Horiba, Ltd.

Shuji Takada

Kazutaka Okamoto

Kengo Yasui

Koji Tominaga

Koichi Matsumoto

Kennosuke Kojima

Takuya Ido

Takuji Oida

Masahiko Ishida

Makoto Matsuhama

Tomoko Seko

Hiroshi Mizutani

Masahiko Endo

A radiation detector includes a Peltier device (electronic cooling unit) for cooling a radiation detecting element, and a heat releasing part of the Peltier device is in thermal contact with a cold finger (thermally conductive part). The cold finger is made of a material with higher thermal conductivity than that of the base, and penetrates the base. The heat from the radiation detecting element is conducted from the heat releasing part of the Peltier device to the cold finger, and is dissipated to an area outside of the radiation detector through the cold finger. As such, heat is efficiently dissipated from the radiation detecting element.

Radiation detector and radiation detection apparatus

A radiation detectorincludes a Peltier device (electronic cooling unit) for cooling a radiation detecting element, and the heat releasing part of the Peltier device is in thermal contact with a cold finger (thermally conductive part). The cold finger is made of a material with higher thermal conductivity than that of the base, and penetrates the base. The heat from the radiation detecting element is conducted from the heat releasing part of the Peltier device to the cold finger, and is dissipated to the outside of the radiation detector through the cold finger. As such, heat is efficiently dissipated from the radiation detecting element.

A radiation detector employed in a radiation detection apparatus and a fluorescent X-ray analyzer includes: a first circuit board on which a semiconductor radiation sensor is mounted and which is cooled by a Peltier device (an electronic cooling unit); and a second circuit board set apart from the first circuit board. A plurality of lead pins are joined to the second circuit board. Then, the first circuit board and the second circuit board are wire-bonded to each other. In comparison with conventional wire bonding performed onto the tips of lead pins, the work of connection is easy, the productivity is high, and the reliability of connection is high. Further, the second circuit board not requiring cooling is set apart so that cooling is concentrated on the first circuit board. This permits size reduction of the radiation detector.

Radiation detector, radiation detection apparatus, and X-ray analyzer

The measurement sensitivity is improved by suppressing the surrounding temperature influence as much as possible, while realizing scale reduction, and by enlarging the detection signal, while reducing the production errors in enclosing a reference gas. Provided is a thermal conductivity sensor that detects thermal conductivity of a sample gas by using a Wheatstone Bridge circuit constructed in such a manner that measurement resistors that are brought into contact with the sample gas are disposed on a first side, and reference resistors that are brought into contact with a reference gas are disposed on a second side, and comparing the potential difference between connection points of the reference resistors and the measurement resistors. The measurement resistors disposed on the first side are assembled in one measurement space, and the reference resistors disposed on the second side are assembled in one reference space.

Thermal conductivity sensor

An optical detector wherein detection elements and are provided in a sealed case whose opening portion is blocked with a window material for transmitting light such as an infrared and an ultraviolet ray therethrough, the detection elements being formed opposite to the window material; and optical filters and are disposed between the window material and the detection elements and and used for selecting and causing only light composed of a predetermined band of wavelengths to be transmitted by thin optical films in connection with the detection elements and . The optical detector includes a shielding body having housing portions and for containing the optical filters and and used for preventing any light composed of other than the predetermined band of wavelength selected by the thin optical films and preventing light producing an interference effect during measurement from being transmitted through the optical filters and

Optical detector

A microflow sensor element for obtaining a response quickly with high response sensitivity regardless of the direction of an air flow. A pyroelectric detection unit is provided on a substrate, the pyroelectric detection unit having an upper and a lower electrode which are respectively provided on the surface and undersurface of a ferroelectric thin film. A heater portion whose temperature is modulated periodically as designated is provided on the upper electrode via a thin film of insulating material.

Microflow sensor element and manufacturing method thereof

A detector,for use in infrared gas analyzers has two compartments,and,to be filled with gas G showing the same absorption characteristics as the gas to be measured and which are arranged in series with a load cell,and the gas compartments,and,communicate with each other via a gas channel,in which a pyroelectric flow detector element,is provided. Pyroelectric flow detector element B is produced by a process which includes the steps of forming a lower electrode,on a substrate,forming a thin ferroelectric film,on the lower electrode, forming an upper electrode,on the thin ferroelectric film, patterning the upper electrode, the thin ferroelectric film and the lower electrode in that order by photolithography, with gas passage holes,being also formed, thereafter forming a thin insulator film,that covers a pyroelectric sensing portion,that is composed of the upper electrode, the thin ferroelectric film and the lower electrode, with gas passage holes and contact holes,and,being also formed in said thin insulator film, forming a heating electrode film on the thin insulator film, patterning the heating electrode film by photolithography, allowing a portion of the heating electrode film to drop in the contact holes to make lead-ins for the upper and lower electrodes, and etching away that part of the substrate which is just under the pyroelectric sensing portion to form an opening

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Kyoto, Japan

Shuji Takada