Kyoto University

Sumitomo Electric Industries, Limited

Shuji Sakabe

Masaki Hashida

Shigeki Tokita

Yasuhiro Okuda

Hidehiko Mishima

Seiji Shimizu

An ultrafast electron diffraction device for irradiating a sample with a bunch of electrons in an ultrashort pulse in order to perform an ultrafast analysis of the sample. The ultrafast electron diffraction device includes: a) a laser emitter for delivering an ultrashort pulse laser having a pulse width of not more than 1 ps onto a target which is a material for generating electrons at an intensity of not less than 1017 W/cm; and b) a pulse compressor for rotating, in a magnetostatic field, a bunch of electrons generated from the target onto which the ultrashort pulse laser has been delivered so as to suppress the spread of the bunch of electrons in their traveling direction. The pulse compressor is composed of an entrance-side parallel-plate static magnet, one end of which is placed on the course of the bunch of electrons, and an exit-side parallel-plate static magnet.

Ultrafast electron diffraction device

A light amplifier includes first and second multi-pass amplifiers, an excitation light source, and a beam splitter. The second multi-pass amplifier includes a light attenuation portion provided in an optical path for a light pulse to travel to pass through a light amplification medium a plurality of times, for attenuating energy of the input light pulse. In addition, an excitation light pulse from the excitation light source is split by the beam splitter into two light pulses. These two pulses are input to the first and second multi-pass amplifiers, respectively. Thus, fluctuation in energy of the light pulse output from the light amplifier can be less than fluctuation in energy of the excitation light pulse.

Light amplifier

A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing the sacrifice layer from the workpiece after the step of forming the through-hole.

Growing community of inventors

Uji, Japan

Shuji Sakabe