Matsushita Electric Industrial Co., Ltd.

Smc Kabushiki Kaisha

Shuji Ono

Hidenobu Nishikawa

Kenji Iida

Ken Kobayashi

Teruo Maruyama

Hiroyuki Otani

Kazuto Nishida

Naoto Hosotani

Hiroshi Yamauchi

Hiroshi Nasu

Takashi Sonoda

Kazumichi Shimizu

Mitsuo Maeno

An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical contact, the electronic component and the circuit formation article are thermocompression-bonded to each other upon curing of the bonding material. A bonding-material flow regulating member of the electronic-component bonding region regulates flow of the bonding material toward a peripheral portion of the electronic-component bonding region during bonding of the circuit formation article to the electronic component.

Electronic parts packaging method and electronic parts package

An apparatus and a method for applying a fluid, which enable an application amount of the fluid to be stabilized even at the start of fluid discharge and at the end of the fluid discharge. The apparatus includes an application head and a control unit, whereby operational control is carried out so that a discharge member is rotated and moved in a discharge direction along an axial direction of the discharge member when the fluid is to be discharged, while the rotation of the discharge member is stopped and the discharge member is moved in a direction opposite to the discharge direction when the discharge is to be stopped. The application amount of the fluid to be applied can be stabilized even at the start of fluid discharge and at the end of the fluid discharge.

Apparatus and method for applying fluid

There is provided an inclination prevention member for preventing a pressing part from inclining to a supporting part. Therefore a pressing face and a stage face can be arranged to be nearly parallel. The pressing face can be thus disposed with the higher parallelism to the bonding stage as compared with the conventional art, so that components and a circuit form object can be bonded with a high bonding quality.

Bonding head and component mounting apparatus

A cylinder apparatus includes a base plate, a piston fixed to the base plate and having a piston head and a piston rod connected thereto, a cylinder body having a cylinder chamber defined on one side of the piston head and a cylinder chamber defined on another side of the piston head around the piston rod, the cylinder body being supported for reciprocating movement with respect to the base plate in axial directions of the piston, an upper plate fixed to the cylinder body, and a bushing held in slidable contact with an outer circumferential wall surface of the cylinder body for guiding the reciprocating movement of the cylinder body.

Moving cylinder apparatus

Cylinder apparatus

Growing community of inventors

Kadoma, Japan

Shuji Ono