Murata Manufacturing Co., Ltd.

Shuji Matsumoto

Akihiro Motoki

Makoto Ogawa

Seiichi Nishihara

Kenichi Kawasaki

Shunsuke Takeuchi

Syunsuke Takeuchi

Toshiyuki Iwanaga

Takuo Wakaoka

Takanori Nakamura

Masanori Okamoto

Takayoshi Obata

Haruhiko Ikeda

Yukio Maeda

Norikazu Kume

A vapor chamber that includes a housing; a pillar arranged in the housing; a working fluid sealed in the housing; and a wick arranged in the housing. The pillar has a first bottom surface and a second bottom surface, and pores therein. The first bottom surface is in contact with a first main interior surface of the housing and the second bottom surface is in contact with the wick. The first bottom surface has an area larger than an area of the second bottom surface. The pillar has a side surface connecting a periphery of the first bottom surface and a periphery of the second bottom surface. A cross-sectional area of the pillar decreases along a direction from the first bottom surface to the second bottom surface.

Vapor chamber having pillars with decreasing cross-sectional area

The present disclosure provides a surge protection device including a ceramic substrate (), at least one pair of discharge electrodes () disposed on a surface of the ceramic substrate () so as to face each other at end portions thereof with a space in between, outer electrodes () electrically connected to the corresponding discharge electrodes (), and a discharge auxiliary electrode () disposed between the end portions of the pair of discharge electrodes () The discharge auxiliary electrode () contains crystalized glass and particles of conductive powder () dispersed apart from each other in the crystalized glass.

Surge protection device, method for manufacturing the same, and electronic component including the same

In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000&#xb0; C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000&#xb0; C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000&#xb0; C. or more is set to about 100&#xb0; C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.

Laminated ceramic electronic component and manufacturing method therefor

A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

Method for manufacturing a multilayer ceramic electronic component

A thermoelectric conversion module which has a P-type thermoelectric conversion material and an N-type thermoelectric conversion material electrically connected to each other. The P-type thermoelectric conversion material and the N-type thermoelectric conversion material are joined with insulating material particles (ceramic spherical particles) interposed therebetween, so as not to be electrically connected to each other. The insulating material particles are joined to the P-type thermoelectric conversion material with a first adhesive material interposed therebetween and to the N-type thermoelectric conversion material with a second adhesive material interposed therebetween, and the P-type thermoelectric conversion material and the N-type thermoelectric conversion material are electrically connected to each other in a region other than the region in which the thermoelectric conversion materials are joined with the first and second adhesive material and the insulating material particles interposed therebetween.

Thermoelectric conversion module and method for manufacturing thermoelectric conversion module

In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.

Laminated ceramic electronic component and manufacturing method thereof

Multilayer ceramic electronic component and manufacturing method thereof

A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.

Monolithic ceramic electronic component and method for manufacturing the same

Provided is an electroconductive paste comprising copper powders, a glass powder, and an organic vehicle, wherein: the copper powders comprise (1) from about 50% to 90% by weight of a copper powder A containing from about 1% to 3% by weight of oxygen and having an average particle size of from about 0.9 to 1.5 &mgr;m; and (2) from about 10% to 50% by weight of a copper powder B containing from about 0.2% to 3% by weight of oxygen and having an average particle size of not more than about 0.6 &mgr;m. It has an excellent electroconductivity as well as a sufficiently large bonding strength to a board.

Electroconductive composition and printed circuit board using the same

A conductive paste which can form a thick film conductor containing no lead, being able to be fired at a middle temperature, superior in conductivity, and having sufficient adhesive strength to a substrate, and a printed wiring board formed using the conductive paste are provided. The conductive paste contains a Cu containing powder; a glass frit; and an organic vehicle, wherein the glass has a composition represented by xBi O &mdash;yB O &mdash;zSiO , where x, y, and z are indicated in mole %, and a composition ratio (x, y, z) within the range surrounded by point A ( ), point B ( ), point C ( ) and point D ( ) in a ternary compositional diagram, and a mean particle diameter of about 0.1 to 1.0 &mgr;m.

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Omihachiman, Japan

Shuji Matsumoto