Osaka Diamond Industrial Co.

Shuichiro Koroku

Ichiro Miyao

Kunio Okada

Azuma Kawata

Hirofumi Kano

Tsunezo Kawase

A rotary blade has a rotary substrate with chips disposed about the outer edge of the substrate. The substrate further has two sets of semicircular slits. The first set of semicircular slits is disposed annularly about the rotary substrate on a circle coaxial with the center of rotation of the rotary blade. The semicircular slits open toward the center of rotation. The second set of semicircular slits are disposed on a circle inside of the circle of first slits. These slits open outwardly, thus blocking, at least partially, the first semicircular slits from the center of rotation. A filler material is filled into the semicircular slits, the slits thus providing a vibration damping effect. The chips may be attached to the outer edge of the rotary substrate by concave profiled cassette stands.

Rotary blade and a rotary substrate for use in the rotary blade

An improved wire saw having a wire rope, a resilient layer covering the outer periphery of the wire rope, and a plurality of sleeves mounted on the wire rope through the resilient layer at spacings, the sleeves having an abrasive layer on their outer periphery. The resilient layer has a smaller outer diameter at portions between the sleeves than over and adjacent to the sleeves. The sleeves or the resilient layer is provided with an engaging portion to axially extend to prevent one of them from turning with respect to the other.

Growing community of inventors

Sakai, Japan

Shuichiro Koroku