Nippon Telegraph and Telephone Corporation

Ntt Electronics Corporation

Shuichiro Asakawa

Shunichi Soma

Ken Tsuzuki

Yuichi Suzuki

Kota Shikama

Shinji Mino

Shin Kamei

Motohaya Ishii

Tomohiro Nakanishi

Hiroshi Fukuda

Masaru Kobayashi

Takashi Saida

Kiyofumi Kikuchi

Ai Yanagihara

Yusuke Muranaka

Mitsuo Usui

Hidetaka Nishi

Shigeo Nagashima

Satoru Konno

Teruaki Sato

Motoki Minami

Hiroshi Tomita

Masahiro Yanagisawa

Toshikazu Hashimoto

Hiroshi Takahashi

Ryo Nagase

Tsutomu Kitoh

Yoshiteru Abe

Seiko Mitachi

Ikuo Ogawa

Tomohiro Shibata

Senichi Suzuki

Yoshiaki Takeuchi

Takeshi Kitagawa

Shin'ichi Iwano

Ryou Nagase

Takaharu Ohyama

Masaki Koutoku

Atushi Aratake

To reduce bad connections of a BGA optical module as an optical fiber interface during mounting by reflowing. An optical module includes: a substrate to which an optical fiber is connected and fixed and on which an electronic circuit, an optical circuit or the like is formed; a ball grid array provided on one face of the substrate as an electrical interface used when the optical module is mounted on a mounting substrate; a lid having a thermal conductivity provided on another face of the substrate; and a fiber routing mechanism provided in contact with the lid, the fiber routing mechanism having a thermal conductivity and shaped to enable the optical fiber to be wound around the fiber routing mechanism.

Optical module

Provided is an optical fiber connection component in which an optical waveguide of a planar lightwave circuit and an optical fiber can be connected after a process using SMT and reflow mounting technology. The optical fiber connection component includes: a plurality of fiber guide holes into which optical fibers are insertable at intervals equal to intervals of a plurality of optical waveguides of the planar lightwave circuit; and grooves for demarcating an area provided with the plurality of fiber guide holes and an area coated with an adhesive in an end surface to be joined with the planar lightwave circuit. The plurality of optical waveguides and the plurality of fiber guide holes are respectively aligned and fixed to the planar lightwave circuit with the adhesive in advance.

Optical fiber connection component and optical device manufacturing method

An optical module that has a structure ensuring reduction in size. The optical module has a structure where a part of a fiber block is protruded from a housing. By including a thin plate, this optical module can avoid entering of dust in the housing, allows a position shift of the fiber block due to a mounting position error of an optical component in the housing, a position shift of an opening portion due to a dimensional error of the housing, or a displacement due to a temperature change, and can reduce the coupling loss due to the optical axis misalignment.

An optical module according to the present invention includes: a first plasmonic waveguide having one end formed of a first metal layer formed over an end portion of a first substrate, and having another end connected to one end of a first optical waveguide; a second metal layer that is formed on a side surface continuous with the end portion of the first substrate and formed to be continuous with the first metal layer; a second substrate provided with a second plasmonic waveguide formed of a third metal layer; and a second optical waveguide that is connected to the second plasmonic waveguide and formed on the second substrate, wherein the second metal layer and a part of the third metal layer are joined together to connect the first substrate to the second substrate.

An optical circuit board which is mounted with a loop-back circuit for returning aligning light to the fiber array in the vicinity of the fiber array connection end. Since an aligning loop-back circuit can be formed in an optical waveguide pattern, a production cost does not increase in comparison to an optical circuit board of the related art. The aligning light combined from the optical fiber to the aligning port of the optical circuit board is returned to the optical fiber around the loop-back circuit. Therefore, it is possible to perform alignment using the returned light. That is, alignment can be performed while being mounted on a package without installing a light-reflecting film or mirror.

Optical device having a fiber array, and method of alignment thereof

An optical module that is connectable to an optical fiber array and that can be packaged in a high density. Two package modules are mounted on a board, and optical waveguides in a Si photonic lightwave circuit mounted on the package module are connected to an optical fiber array fixed to an optical fiber block. Moreover, output end surfaces of the optical waveguides in the Si photonic lightwave circuit are perpendicular to a mount surface of the package module. The optical waveguides in the Si photonic lightwave circuit may be tilted at an appropriate angle with respect to a direction perpendicular to a right end surface. Moreover, the optical fiber block fixes optical fibers with the optical fibers tilted with respect to a direction perpendicular to an end surface connected to the Si photonic lightwave circuit.

In a conventional soldering method, an FPC-side electrode pad and a package-side electrode pad are closely joined together with a solder layer, and the soldered state after a joining process has not been easily confirmed visually. The present invention provides a solder joint structure including a side face electrode which is formed on each of the side faces of the end parts of an FPC board and a package or PCB board that are to be soldered, extending vertically relative to the faces constituting each of electrode pads on the boards, and which introduces solder. On the side face electrodes of the board end parts, a part of solder that is formed continuously from the solder joint portion is visible and the state of the solder joint between the electrode pads on the two boards can be confirmed. The efficiency of solder joint tests can be improved.

Solder joint structure of flexible printed circuit board

Even in the case of an optical module including a multi-chip integrated device, an optical module having a smaller size in consideration of the connection to optical fibers. An optical module having a package containing a multi-chip integrated device integrated with an optical functional element having both ends connected to planar lightwave circuits (PLCs) is provided. Each of the PLCs includes a folded waveguide for connecting a light waveguide formed in the optical functional element to optical fibers. The optical module comprises a connecting part connected to each of the PLCs for connecting the optical functional element to the optical fibers in the same face. The optical fibers are taken out from opposed surfaces of the package.

A wave transmission medium includes an input port-and an output port-. A field distributionand a field distributionare obtained by numerical calculations. The field distributionis a field distribution of the propagation light (forward propagation light) launched into the input port-. The field distributionis a field distribution of the phase conjugate light (reverse propagation light) resulting from reversely transmitting from the output port side an output field that is expected to be output from the output port-when an optical signal is launched into the input port-. According to the field distributionsand, a spatial refractive index distribution is calculated such that the phase difference between the propagation light and reverse propagation light is eliminated at individual points (x, z) in the medium.

Wave transmission medium and waveguide circuit

When plug is fitted to adapter, optical fiber is inserted to an alignment hole for the optical fiber. By providing a taper at the entrance thereof, even if the tip of the optical fiber is deviated from the central position, the deviation is absorbed to make it possible for the optical fiber to be inserted smoothly. When two plugs is fitted to adapter, the tip of one optical fiber is confronted with the other one in the alignment hole, and excessive length L.sub.1 -L.sub.2 is pushed into the two optical fiber-bending spaces with a suitable distribution, thus the optical fiber buckles therein. The end face of the optical fiber is subjected to flat surface-polishing, removal of ripples after being cleaved, or chamfer grinding after being cleaved. The buckling portion of the optical fiber is coated with carbon or the like.

Optical connector

Growing community of inventors

Atsugi, Japan

Shuichiro Asakawa