Fuji Xerox Co., Ltd.

Shuichi Yamada

Michiaki Murata

Mutsuya Takahashi

Hiroyuki Usami

Hiroshi Ikeda

Kazuhiro Hayashi

Naoki Morita

Takahiro Hashimoto

Koichi Haga

Tsutomu Otsuka

Kenichi Ono

Takeshi Minamiru

Nanao Inoue

Yoshinao Kondoh

Kenji Yamazaki

Hiroaki Tezuka

A method of manufacturing a heating device includes preparing a substrate having a curved surface; and forming a heating body on the substrate, the heating body generating heat with a supply of electric current. The forming of the heating body includes pressing a screen toward the substrate with an aid of a pressing member while rotating the substrate and moving the screen, and transferring application liquid that is to form the heating body to the substrate through the screen. In the forming of the heating body, the pressing member is in contact with the screen at a position on an upstream side with respect to a transfer position in a direction of movement of the screen.

Method of manufacturing heating device by screen printing

A semiconductor piece manufacturing method includes: a process of forming a groove on a front surface side including a first groove portion having a first width from a front surface of a substrate and a second groove portion that is positioned in a lower part that communicates with the first groove portion and has a second width larger than the first width; and a process of forming a groove on a rear surface side having a width greater than the first width along the second groove portion from a rear surface of the substrate by a rotating cutting member.

Semiconductor piece manufacturing method and substrate dicing method for suppressing breakage

A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width that is gradually narrowed from a front surface of a semiconductor substrate W toward a rear surface thereof; a process of attaching a dicing tape having an adhesive layer on the front surface after the fine groove on the front surface side is formed; a process of forming a groove on a rear surface side having a width greater than the width of the fine groove on the front surface side along the fine groove on the front surface side from a rear surface side of the substrate by a rotating dicing blade; and a process of separating the dicing tape from the front surface after the groove on the rear surface side is formed.

Semiconductor piece manufacturing method

A fabrication method of a semiconductor piece includes forming a groove that has a first groove portion, and a second groove portion which is a groove portion formed to communicate with a lower part of the first groove portion and extends toward a lower part at a steeper angle than an angle of the first groove portion, has a shape without an angle portion between the first groove portion and the second groove portion, is positioned on the front side, and is formed by dry etching; affixing a retention member including an adhesive layer to the surface in which the groove on the front side is formed; thinning the substrate from the back side of the substrate in a state in which the retention member is affixed; and removing the retention member from the surface after the thinning.

Fabrication method of semiconductor piece

A design method includes a process of preparing plural cutting members having different degrees of taper in a tip portion thereof, a process of preparing plural grooves on a front surface side having the same shape, a process of confirming a breakage status when a groove on a rear surface side is formed by the plural cutting members, and a process of selecting, when it is confirmed that both of a cutting member that causes breakage and a cutting member that does not cause the breakage are included, the degree of taper of the cutting member that does not cause the breakage as a tip shape of a cutting member to be used in a mass production process.

Method of tip shape of cutting member, semiconductor chip manufacturing method, circuit board, and electronic apparatus

According to an aspect of the invention, a light-emitting element includes a semiconductor layer, a gold electrode layer, an insulator, a barrier metal layer, and an aluminum wiring layer. The gold electrode layer is formed on a part of the semiconductor layer and is electrically connected to the semiconductor layer. The gold electrode layer being made of metal including gold. The insulator film covers the semiconductor layer and has a contact opening corresponding to the gold electrode layer. The barrier metal layer covers a an upper face of the gold electrode layer and the insulator film in a vicinity of the contact opening. The aluminum wiring layer is formed on the barrier metal layer and electrically connected to the barrier metal layer.

Light-emitting element and light-emitting element fabrication method

There are provided a structure of an ink-jet recording head comprising a substrate; a first conductive layer provided on the substrate; an insulating layer provided on the first conductive layer; a second conductive layer formed on the insulting layer and coming into contact with the first conductive layer; and a heat generation layer disposed on the second conductive layer and having, on a surface thereof, a self-oxidized protective film as an ink-contact interface, in order that metal conductive layer material having excellent energy efficiency and typified as aluminum, which is generally used as semiconductor material, can be used.

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Ebina, Japan

Shuichi Yamada