Toshiba Memory Corporation

Kabushiki Kaisha Toshiba

Other

Kioxia Corporation

Shuichi Tsubata

Masatoshi Yoshikawa

Kazuhiro Tomioka

Satoshi Seto

Tatsuya Kishi

Yasuyuki Sonoda

Kenji Noma

Hiroaki Yoda

Yutaka Hashimoto

Daisuke Watanabe

Toshihiko Nagase

Katsuya Nishiyama

Kazuya Sawada

Hisanori Aikawa

Youngmin Eeh

Tadaaki Oikawa

Kenichi Yoshino

Masaru Toko

Takao Ochiai

Hirotaka Ogihara

Ga Young Ha

According to an embodiment, a magnetoresistive memory device includes a layer stack. The layer stack includes a first ferromagnet, an insulator on the first ferromagnet, and a second ferromagnet on the insulator. A nonmagnet is provided above the layer stack. A first conductor is provided on the nonmagnet. A hard mask is provided above the first conductor. The nonmagnet includes a material that is removed at a first etching rate against a first ion beam. The first conductor includes a material that is removed at a second etching rate against the first ion beam. The first etching rate is lower than the second etching rate.

Magnetoresistive memory device and method of manufacturing magnetoresistive memory device

According to one embodiment, a magnetic memory device includes a stacked structure including a magnetic layer, a first insulating layer covering the stacked structure and including a protrusion based on the stacked structure, a second insulating layer provided on the first insulating layer, and an electrode connected to the stacked structure. The first insulating layer has a first hole passing through the first insulating layer, the electrode is connected to the stacked structure at least through the first hole, the second insulating layer has a second hole inside of which a part of the electrode and the protrusion are provided, and the second hole includes a part whose area increases toward the stacked structure.

Magnetic memory device and manufacturing method thereof

According to one embodiment, a magnetic memory device includes a stacked structure including a first magnetic layer, a second magnetic layer and a nonmagnetic layer between the first magnetic layer and the second magnetic layer, and a sidewall insulating layer provided on a side surface of the stacked structure and containing boron (B).

Magnetic memory device with sidewall layer containing boron and manufacturing method thereof

According to one embodiment, a method of manufacturing a magnetic memory device, includes forming a stack film including a magnetic layer on an underlying area, forming a hard mask on the stack film, forming a stack structure by etching the stack film using the hard mask as a mask, forming a first protective insulating film on a side surface of the stack structure, and performing an oxidation treatment.

Magnetic memory device and method of manufacturing the same

According to one embodiment, a magnetic memory device includes a stacked structure, the stacked structure including a first magnetic layer having a variable magnetization direction, a second magnetic layer having a fixed magnetization direction and a nonmagnetic layer provided between the first magnetic layer and the second magnetic layer, wherein the nonmagnetic layer comprises a structure in which a first oxide layer formed of a first metal oxide and a second oxide layer formed of a second metal oxide having a relative dielectric constant greater than a relative dielectric constant of the first metal oxide are stacked.

Magnetic memory device

According to one embodiment, a magnetic memory device includes a stacked structure including a first magnetic layer having a variable magnetization direction, a nonmagnetic layer provided on the first magnetic layer, and a second magnetic layer provided on the nonmagnetic layer and having a fixed magnetization direction, wherein as viewed in a direction parallel to a stacked direction of the stacked structure, a pattern of a lower surface of the first magnetic layer is located inside a pattern of an upper surface of the first magnetic layer, and a pattern of an upper surface of the second magnetic layer is located inside a pattern of a lower surface of the second magnetic layer or substantially conforms to the pattern of the lower surface of the second magnetic layer.

A magnetoresistive effect element according to one embodiment includes: a first magnetic layer; a nonmagnetic layer; a second magnetic layer; a metal layer; and a third magnetic layer. An area of a bottom of the third magnetic layer is larger than an area of a top of the third magnetic layer. An angle between the top of the third magnetic layer and a side of the third magnetic layer is larger than an angle between a top of the second magnetic layer and a side of the second magnetic layer, or an angle between the bottom of the third magnetic layer and a side of the third magnetic layer is smaller than an angle between the bottom of the second magnetic layer and a side of the second magnetic layer.

Magnetoresistive element and method of manufacturing the same

A magnetic memory device includes a stacked structure including a magnetic element, a protective insulating film covering the stacked structure, and an interface layer provided at an interface between the stacked structure and the protective insulating film. The interface layer contains a predetermined element which is not contained in the magnetic element or the protective insulating film.

According to one embodiment, a magnetic memory device includes a stacked structure including a magnetic layer, and an upper structure provided on the stacked structure, and including a first portion and a second portion surrounding the first portion and formed of material different from that of the first portion.

Magnetic memory device including upper structure having first portion and second portion surrounding first portion and formed of material different from that of first portion, and method of manufacturing the same

According to one embodiment, a semiconductor memory device includes a magnetoresistive element and an insulating layer. The magnetoresistive element includes a first magnetic layer, a nonmagnetic layer, and a second magnetic layer and. The magnetoresistive element is capable of storing data according to a direction of magnetization in the first magnetic layer. The insulating layer covers a side surface of the magnetoresistive element. The first magnetic layer includes a first region and a second region. Each of the first and second regions includes a magnetic material and a nonmagnetic material. A concentration ratio of the nonmagnetic material to the magnetic material is higher in the second region than in the first region.

Semiconductor memory device with magnetoresistive element

According to one embodiment, a magnetic memory device includes an interlayer insulating film, a bottom electrode formed in the interlayer insulating film, a buffer layer formed on the bottom electrode, and a stacked structure formed on the buffer layer and including a first magnetic layer functioning as a magnetic storage layer, wherein a portion of the buffer layer located on a central portion of the bottom electrode is thicker than a portion of the buffer layer located on a peripheral portion of the bottom electrode.

According to one embodiment, a method of manufacturing a magnetic memory device includes a stack structure formed of a plurality of layers including a magnetic layer, the method includes forming a lower structure film including at least one layer, etching the lower structure film to form a lower structure of the stack structure, forming an upper structure film including at least one layer on a region including the lower structure, and etching the upper structure film to form an upper structure of the stack structure on the lower structure.

Magnetic memory device and method of manufacturing magnetic memory device

According to one embodiment, a magnetic memory includes a transistor having first and second diffusion layers in a semiconductor substrate and a gate electrode between the first and second diffusion layers, a first insulating layer on the semiconductor substrate, the first insulating layer covering the transistor, a first contact plug in the first insulating layer, the first contact plug connected to the first diffusion layer, a second contact plug in the first insulating layer, the second contact plug connected to the second diffusion layer, a magnetoresistive element on the first insulating layer, the magnetoresistive element connected to the first contact plug, an electrode on the magnetoresistive element, and an impurity region in the first insulating layer, the second contact plug, and the electrode.

Magnetic memory having magnetoresistive element and method of manufacturing magnetoresistive element

According to one embodiment, a magnetic memory device includes a stacked structure including a magnetic element, a protective insulating film covering the stacked structure, and an interface layer provided at an interface between the stacked structure and the protective insulating film. The interface layer contains a predetermined element which is not contained in the magnetic element or the protective insulating film.

According to one embodiment, a magnetic memory device includes a first stack structure including a first magnetic layer, and a first nonmagnetic layer provided on the first magnetic layer, a second stack structure including a second magnetic layer provided on the first nonmagnetic layer, a second nonmagnetic layer provided on the second magnetic layer, and a top conductive layer provided on the second nonmagnetic layer, and a sidewall conductive layer provided on a sidewall of the second stack structure.

Growing community of inventors

Seoul, South Korea

Shuichi Tsubata