Seiko Epson Corporation

Shuichi Tanaka

Haruki Ito

Eiju Hirai

Chikara Kojima

Koji Ohashi

Hiroshi Matsuda

Hironori Suzuki

Yasuyuki Matsumoto

Hideo Imai

Motoki Takabe

Tsuyoshi Yoda

Yasuhito Aruga

Michiyoshi Takano

Ryohei Tamura

Nobuaki Hashimoto

Atsushi Saito

Yasuo Yamasaki

Naohiro Nakagawa

Hisashi Miyazawa

Fujio Akahane

Yoichi Naganuma

Akira Sano

Katsutomo Tsukahara

Munehide Saimen

Yasushi Matsuno

Mitsuru Kuribayashi

Toshiaki Hamaguchi

Ikuya Miyazawa

Masashi Yoshiike

Naoya Sato

Daisuke Yamada

Koji Asada

Tatsuhiko Asakawa

Hiroki Kato

Tomoyoshi Saito

Toshinari Nanba

Kunihiko Aoyagi

Kato Hiroki

A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, and electronic apparatus

A mounting structure includes a first substrate that has a first surface on which a functional element is provided, a wiring that is provided at a position which is different from a position of the functional element on the first surface, and is connected to the functional element, a second substrate that has a second surface facing the first surface, and a conductor that is provided on the second surface, and is connected to the wiring and the functional element, in which the shortest distance between the functional element and the second substrate is longer than a distance between a position where the wiring is connected to the conductor, and the second substrate.

A piezoelectric device (an actuator unit) includes the following: a first substrate (a pressure chamber forming substrate, a diaphragm) having a piezoelectric layer and a first wiring conductor (a top electrode layer) that is at least partially stacked on the piezoelectric layer; and a second substrate (a sealing substrate) having a second wiring conductor (a bottom wiring conductor) that faces and is separated from the first wiring conductor (a top electrode layer) and to which an electrical signal different from an electrical signal that is applied to the first wiring conductor (a top electrode layer) is applied. At least one of the first wiring conductor (a top electrode layer) and the second wiring conductor (a bottom wiring conductor) is at least partially covered with an electrically insulating protective layer.

Piezoelectric device, MEMS device, liquid ejecting head, and liquid ejecting apparatus

Provided are a liquid jet head with which the size-reduction can be achieved, while the resistance of wiring formed on a wiring plate such as a sealing plate is lowered, and a method for manufacturing the liquid jet head. The liquid jet head includes: a sealing plate having a first surface to which a pressure chamber-forming plate including multiple piezoelectric elements is joined and a second surface which is on a side opposite from the first surface and to which a drive IC that outputs signals for driving the piezoelectric elements is joined, wherein a lower surface-side embedded wire connected to a common wire common to the driving elements are formed on the first surface of the sealing plate, and the lower surface-side embedded wire is at least partially embedded in the sealing plate.

Liquid jet head and method for manufacturing liquid jet head

A MEMS device includes a wire that is formed of a conductive portion embedded into a recess opened in a first face of a substrate and a bump electrode that is electrically connected to the wire. A total width, in a second direction intersecting a first direction along which the wire extends on the first face, of an opening of the recess in a connection region where the wire and the bump electrode are electrically connected to each other is narrower than a width, in the second direction, of an opening of the recess in a region outside the connection region.

MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method

Provided is an electronic device in which penetrating wires can be formed easily. The electronic device includes a sealing platehaving a first surfaceto which a pressure chamber-forming plateis connected and a second surfacewhich is on a side opposite from the first surfaceand on which a drive ICis provided; bump electrodeswhich are arranged in a nozzle row direction on the first surfaceof the sealing plateand which output signals to piezoelectric elements; individual connection terminalswhich are arranged in the nozzle row direction on the second surfaceof the sealing plateand to which the signals are inputted, wherein wires each of which connects one of the bump electrodesto one of the individual connection terminalscorresponding to the bump electrodeeach include a penetrating wireformed inside a through holepenetrating the sealing plateand made of a conductor, the penetrating wiresare formed at positions away from the bump electrodesor the individual connection terminalsin a direction perpendicular to the nozzle row direction, and each two of the penetrating wiresadjacent in the nozzle row direction are arranged at different positions in the direction perpendicular to the nozzle row direction.

Electronic device

There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.

MEMS device, liquid ejecting head, manufacturing method of MEMS device, and manufacturing method of liquid ejecting head

Provided are a liquid jet head with which the size-reduction can be achieved, while the resistance of wiring formed on a wiring plate such as a sealing plate is lowered, and a method for manufacturing the liquid jet head. The liquid jet head includes: a sealing platehaving a first surfaceto which a pressure chamber-forming plateincluding multiple piezoelectric elementsis joined and a second surfacewhich is on a side opposite from the first surfaceand to which a drive ICthat outputs signals for driving the piezoelectric elementsis joined, wherein a lower surface-side embedded wireconnected to a common wirecommon to the driving elementsare formed on the first surfaceof the sealing plate, and the lower surface-side embedded wireis at least partially embedded in the sealing plate

A liquid ejecting head and a method of manufacturing the liquid ejecting head are provided. The liquid ejecting head has a pressure-chamber-forming substrate that includes a plurality of piezoelectric elements and that is connected to a first surface of a sealing plate, a driver IC that outputs signals that drive the piezoelectric elements and that is provided on a second surface of the sealing plate that is on the opposite side to the first surface, and a power supply wire that supplies electrical power to the piezoelectric elements, that is formed in the second surface of the sealing plate, and that has at least one portion thereof embedded in the sealing plate and a surface thereof exposed on the second surface side.

Liquid ejecting head and method of manufacturing liquid ejecting head

Provided are an MEMS device, a head, and a liquid jet device in which substrates are inhibited from warping, so that a primary electrode and a secondary electrode can be reliably connected to each other. Included are a primary substrateprovided with a bumpincluding a primary electrode, and a secondary substrateprovided with a secondary electrodeon a bottom surface of a recessed portionformed by an adhesive layer. The primary substrateand the secondary substrateare joined together with the adhesive layer, the primary electrodeis electrically connected to the secondary electrodewith the bumpinserted into the recessed portion, and part of the bumpand the adhesive layerforming the recessed portionoverlap each other in a direction in which the bumpis inserted into the recessed portion

MEMS device, head and liquid jet device

An electronic device includes a first substrate including a structure body protruded from one surface; and a second substrate stacked and disposed facing the one surface through a spacer, in which the first substrate and the spacer are bonded to each other by an adhesive, and in which the adhesive is extended up to the structure body along the one surface.

Electronic device, liquid ejecting head, and manufacturing method of electronic device

An electronic device includes a sealing plate including a first surface connected to a pressure chamber formation substrate, and a second surface having a drive IC provided thereon. The sealing plate includes a first region in which a plurality of individual connection terminals are arranged, and a second region in a position different from the first region. A plurality of bump electrodes are arranged at a pitch different from a pitch of an individual connection terminals, in a region overlapping a second region, and a wiring group connecting the individual connection terminal and a bump electrode includes a first wiring of which a position of a pass-through wiring relaying the first surface and the second surface is within the first region. A second wiring of which a position of a pass-through wiring connecting the first surface and the second surface is within the second region.

A wiring substrate is provided with a surface wiring on at least one surface, a through hole which passes through the wiring substrate, and a through wiring which is formed in the through hole and is connected to a surface wiring, in which an inner surface of the through hole is a rough surface, and electric resistance of the through wiring is equal to or less than the electric resistance of the surface wiring.

Growing community of inventors

Chino, Japan

Shuichi Tanaka