Fujitsu Corporation

Shuichi Takeuchi

Hidehiko Kira

Kenji Kobae

Hiroshi Kobayashi

Tetsuya Takahashi

Takayoshi Matsumura

Yoshiyuki Satoh

Norio Kainuma

Yoshiaki Yanagida

Naoki Ishikawa

Hirokazu Yamanishi

Yukio Ozaki

Shinji Hiraoka

A multichip module includes a package substrate, a first semiconductor device, a second semiconductor device and a conductive bump. The first semiconductor device is flip-chip bonded to the package substrate. The first semiconductor device includes a first chip pad on a surface thereof. The second semiconductor device is mounted on the first semiconductor device. The second semiconductor device includes a second chip pad facing the first chip pad. The conductive bump connects the first chip pad to the second chip pad. The conductive bump includes a first metallic body that has a first diffusion rate and a second metallic body that has a second diffusion rate lower than the first diffusion rate.

Multichip module, printed circuit board unit, and electronic apparatus

An RFID tag includes an inlet on which an antenna pattern serving as an antenna for communication and an IC chip electrically connected to the antenna pattern are mounted. The RFID tag also includes an exterior body that encloses the inlet from outside and a hollow space that is formed by the inlet and the exterior body and that is filled with gas or a gel material.

RFID tag and manufacturing method thereof

According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

Electronic part with affixed MEMS

An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes concentric rings as an internal structure. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device

An electronic device includes: a base; a conductor pattern formed on the base; and a circuit chip electrically connected to the conductor pattern. The electronic device further includes a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes layers stacked in the thickness direction of the base. The lowermost layer of the layers is closest to the base and softer than the layer that is at least one of the remaining layers. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

A resin filling apparatus, a filling method, and a method of manufacturing an electronic device fill a cavity between a substrate and an electronic component mounted on the substrate with resin. The resin filling apparatus includes a stage for supporting the substrate in an inclined state, and an application head for filling the cavity with resin from a lower side of the inclined substrate.

Resin filling apparatus, filling method, and method of manufacturing an electronic device

A tag manufacturing system includes an antenna forming apparatus which forms multiple antennas in such a way that the antennas are formed in a point-symmetrical arrangement including antenna orientations, on a long base sheet large enough to place multiple bases, and winds the base sheet into a roll body; an IC chip mounting apparatus which pulls the base sheet out of the roll body, mounts an IC chip on each of the antennas formed on the pulled base sheet in an orientation corresponding to an orientation of each antenna, and electrically connects the IC chip with the antenna; and a post-processing apparatus which performs post-processing of the base sheet with the IC chips mounted on the antennas to work up the base sheet into finished RFID tags.

Electronic device manufacturing system and electronic device manufacturing method

A mounting structure for an IC tag where an IC chip for mounting () is mounted so as to be electrically connected to antenna patterns (), (). The assembly process that mounts the IC chip for mounting () on the antenna patterns (), () is simplified, which makes it possible to reduce the manufacturing cost of IC tags. The IC chip for mountingis formed by winding conductive wires (), () so as to encircle an outer surface of an IC chip () between two opposite edges of the IC chip () in a state where the conductive wires (), () mechanically contact electrodes formed on the IC chip () and are electrically connected to the electrodes, so that the IC chip for mounting () is joined to the antenna patterns (), () via the conductive wires (), ().

Mounting structure for IC tag and IC chip for mounting

An electronic device includes: a base; a conductor pattern formed on the base; a circuit chip electrically connected to the conductor pattern; and a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which has such an internal structure that a plurality of columns extending in the thickness direction of the base are dispersed in a predetermined substrate. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

An electronic apparatus manufacturing method comprises applying a first adhesive agent to a mounting portion, a first heating, in such a way that connection pads and bumps, come into contact, by pressing a heating head against a non-mounting surface of the electronic component, heating the electronic component, hardening the first adhesive agent, affixing the mounting substrate and electronic component, filling a space between the mounting substrate and the electronic component with a second adhesive agent under reduced pressure, and a second heating step of, from being under reduced pressure to being under atmospheric pressure, by pressing the heating head against the non-mounting surface of the electronic component, heating the electronic component, as well as hardening the second adhesive agent, melting the connection pads, and joining the connection pads and the bumps.

Electronic apparatus manufacturing method

When bonding a workpiece to a substrate, processed parts of the substrate and the workpiece are observed and behavior such as the production of voids and the flowing of resin is observed. An apparatus for observing an assembled state of components includes: a stage on which a substrate is set; a head mechanism that bonds, by applying heat and pressure, an observation workpiece made of a transparent material to the substrate via resin supplied between the substrate and the observation workpiece; a light source that irradiates an observed part of the substrate and the observation workpiece mounted on the stage with light; and a camera that takes, from the observation workpiece side, an image of the observed part when the observation workpiece is bonded to the substrate set on the stage.

Apparatus for observing an assembled state of components and method of observing an assembled state of components using such apparatus

A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support partthat tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic bodycomposed of a plate spring that contacts the movable support part and elastically presses the movable support part.

Slider tester

An ultrasonic tool, for bonding two materials to each other by joining a face of one of the materials to a face of the other material using the action of ultrasonic waves applied to one of the materials through another face of the one of the materials, wherein the ultrasonic tool has a coating layer comprising chromium oxide as a main component formed on at least the surface of the tool that is in contact with the face of the one of the materials through which the ultrasonic waves are applied to the one of the materials. An ultrasonic bonder provided with the ultrasonic tool is also disclosed.

Ultrasonic tool and ultrasonic bonder

In the method of forming a multi-piled bump, metal balls can be stably and securely piled so as to form the multi-piled bump having a prescribed height. The method of the present invention comprises the steps of: holding a metal wire by a capillary; sparking and melting the wire so as to form metal balls; piling a plurality of the metal balls with applying a load and ultrasonic vibrations thereto, and characterized in that a tail length of the metal wire, which is held by the capillary, is controlled to make a gap between a center of the metal wire and a center of the metal ball one half of a diameter of the metal wire or less.

Growing community of inventors

Kawasaki, Japan

Shuichi Takeuchi