Ebara Corporation

Shuichi Suemasa

Yutaka Kobayashi

Hiroyuki Shinozaki

Tomoatsu Ishibashi

Tomoaki Fujimoto

A substrate holding and rotation mechanism includes: a substrate holding roller that holds a peripheral portion of the substrate and rotates the substrate, the substrate holding roller including, a lower portion of the roller facing the lower surface of the peripheral portion of the substrate, an upper portion of the roller facing the upper surface of the peripheral portion of the substrate, and a clamping groove which is provided between the lower portion of the roller and the upper portion of the roller and into which the peripheral portion of the substrate is inserted; and a roller washing nozzle that injects a fluid from diagonally above the substrate holding roller to an area including the clamp groove and an upper surface of the upper portion of the roller.

Substrate holding and rotation mechanism and substrate processing apparatus

The disclosure provides a jig for attaching and detaching a cleaning member, which facilitates attaching and detaching the cleaning member to and from a rotation device without holding the cleaning member directly by hand, even when there is no sufficient spacing around the cleaning member. The jigfor attaching and detaching a cleaning memberincludes a pair of jig bodiescapable of clamping two endsof a holderof the cleaning member, and a connecting mechanismthat interlocks the movements of the pair of jig bodiesbetween a clamped state in which two endsof the holderare clamped and a non-clamped state in which the clamped state is released.

Jig for attaching and detaching cleaning member

A break-in apparatushas a supply unitfor supplying a cleaning liquid, a substrate support unitfor holding a dummy substrate Wand a cleaning member holding unitfor performing a break-in processing on the cleaning memberby rotating the cleaning memberand bringing the cleaning memberinto contact with the dummy substrate W

Break-in apparatus, break-in system and storage media

A self-cleaning device of the present disclosure includes: a cleaning member configured to clean a cleaning tool that cleans a substrate; and an injection unit configured to inject a liquid toward the cleaning member or the cleaning tool. The cleaning member has a cleaning surface that cleans the cleaning tool when the cleaning tool is pressed thereagainst, and the cleaning surface is inclined with respect to a horizontal plane.

Self-cleaning device and substrate processing apparatus

An apparatus for replacing a polishing table, which is used in a polishing apparatus for polishing a substrate such as wafer, is disclosed. The polishing table replacement apparatus () is used for removing a polishing table () from a polishing apparatus (). This polishing table replacement apparatus () includes a crane () configured to move the polishing table () vertically and horizontally, a table stage () on which the polishing table () can be placed, and a table-stage tilting mechanism () configured to tilt the table stage ().

Polishing table replacement apparatus, polishing table replacement method, and apparatus for replacing a component of semiconductor-device manufacturing machine

Growing community of inventors

Tokyo, Japan

Shuichi Suemasa