Sony Corporation

Sony Semiconductor Solutions Corporation

Fujitsu Corporation

Shuichi Oka

Shusaku Yanagawa

Shinji Rokuhara

Hiizu Ootorii

Eiji Otani

Kiwamu Adachi

Katsuji Matsumoto

Shun Mitarai

Kazunao Oniki

Takahiro Igarashi

Seiichi Miyai

Naoki Kakoiyama

Izuho Hatada

Takeshi Kodama

Hideyuki Suzuki

Shinya Morita

Hiroshi Ozaki

Hiroshi Morita

Kenichiro Abe

Hiizu Ohtorii

Takeshi Ogura

Kousuke Seki

Hiroyuki Shigeta

Kei Fukui

Susumu Hogyoku

Kazuhiko Iijima

Rei Takamori

Kazuya Arai

Koji Komemura

Kei Satou

Terukazu Ohno

Koki Uchino

Kazuki Sano

Yuto Tanaka

Kazunari Saitou

Provided is a semiconductor device capable of maintaining the flatness of a glass substrate and sufficiently protecting an end portion of the glass substrate. The semiconductor device includes a glass substrate including a first surface, a second surface opposite to the first surface, and a first side surface between the first surface and the second surface. The semiconductor device further includes wirings provided provided on the first and second surfaces, a first insulating film that covers the first surface, a second insulating film that covers the second surface, and a third insulating film that covers the first side surface, the third insulating film being continuous with at least one of the first or second insulating films.

Semiconductor device

Provided is a semiconductor device enabling the flatness of a glass substrate to be maintained and enabling the end portion of the glass substrate to be sufficiently protected. A semiconductor device according to the present disclosure includes a glass substrate that includes a first surface, a second surface provided on the opposite side of the first surface, and a first side surface provided between the first surface and the second surface, a wiring that is provided on the first and second surfaces, a metal film that covers the first side surface, and a frame that is provided further on the outer side than the metal film, and that is bonded to the metal film at the first side surface.

To eliminate influence caused by a difference in coefficient of linear expansion between a substrate and another material, and to secure a stable mounting structure of a semiconductor element. A semiconductor device includes a glass substrate and the semiconductor element. The glass substrate includes a through hole that penetrates front and back surfaces. Furthermore, the glass substrate includes a stepped portion on an outer periphery of the through hole. The semiconductor element is joined to the stepped portion of the glass substrate. For example, in a case where an imaging element is used as the semiconductor element, image quality of an image obtained by imaging is improved by preventing defocus of light incident on the imaging element.

An antenna device and a wireless communication apparatus capable of implementing increase in bandwidth and reduction of the manufacturing cost are provided. The antenna device includes a first antenna element and a second antenna element arranged on one face side of the first antenna element. The first antenna element includes a first glass substrate and a first patch antenna provided on the first glass substrate. The second antenna element includes a second glass substrate and a second patch antenna provided on the second glass substrate. At least part of the first patch antenna faces the second patch antenna with an air gap interposed therebetween.

Antenna device and wireless communication apparatus

An optical connector includes a core block, a flexible wiring board, an optical device array, a drive circuit, and a housing. The core block has a plurality of faces. The flexible wiring board has an external connection terminal, a first area arranged on a first face of the core block, and a second area arranged on a second face of the core block. The optical device array is mounted on the first area of the flexible wiring board and includes at least one group of a plurality of optical devices for transmission and a plurality of optical devices for reception arranged. The drive circuit is mounted on the second area of the flexible wiring board and drives the optical device array. The housing stores the core block, the optical device array, and the drive circuit such that the external connection terminal of the flexible wiring board is arranged outside the housing.

Optical connector, electronic apparatus and optical interconnection system

An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.

Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system

A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.

Photoelectric module and optical device

A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.

Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate

A method of manufacturing a mounting substrate according to an embodiment of the present technology includes the following three steps:

Mounting substrate and method of manufacturing the same

A wiring substrate includes a laminated sheet including a first conductor pattern, an inorganic dielectric layer, and a second conductor pattern. The first conductor pattern, the inorganic dielectric layer, and the second conductor pattern are laminated in this order. Also, the first conductor pattern is divided into a plurality of regions.

Wiring substrate and manufacturing method of wiring substrate

There is provided a radiation detector including: a plurality of photoelectric conversion devices, each photoelectric conversion device formed at least partially within an embedding layer and having a light receiving surface situated at least partially outside of the embedding layer, and a plurality of scintillator crystals, at least a first scintillator crystal of the plurality of scintillator crystals in contact with at least one light receiving surface at a proximal end, wherein a cross-section of the first scintillator crystal at the proximal end is smaller than a cross-section of the first scintillator crystal at a distal end.

Radiation detector, imaging unit, and imaging and display system

A multilayer wiring board includes: a functional area which includes a thin film capacitor having a dielectric layer between an upper electrode and a lower electrode; and a peripheral area other than the functional area, wherein a mooring portion in which the dielectric layer and a conductive layer are laminated is provided in at least a portion of the peripheral area, and a roughness of a surface of the conductive layer which contacts the dielectric layer is greater than a roughness of a surface of the upper electrode or the lower electrode which contacts the dielectric layer.

Peel resistant multilayer wiring board with thin film capacitor and manufacturing method thereof

Growing community of inventors

Kanagawa, Japan

Shuichi Oka