Matsushita Electric Industrial Co., Ltd.

Shuichi Murakami

Kazuhiro Mori

Eiji Itemadani

Yukio Maeda

Yoshifumi Kitayama

Fabrication of an electronic circuit board is carried out by forming a predetermined number of resistors having various resistances based on a circuit design stored in a memory on a nonconductive substrate and dividing the nonconductive substrate into discrete resistors, then mounting the discrete resistors on a circuit board and testing operation characteristic thereof; and when some resistors having resistances which are not suitable to obtain a predetermined operation characteristic exist in the above-formed resistors, the resistances are corrected, and electronic circuit board having corrected accurate electric constants is obtained; and thereby a complete electronic circuit boards are fabricated by repetition of above-mentioned respective steps.

Method for fabricating electronic circuit board

A bonding method of semiconductor device by using a film carrier; A heat-resistive insulating layer is deposited all over the surface of a dummy wafer on which a photo-resist film having a predetermined pattern is previously formed; The photo-resist film is removed together with the heat-resistive insulating layer for forming openings; Bumps are formed on the openings by plating using the heat-resistive insulating layer as a mask; After transferring the bumps to inner leads, the bumps of the inner leads are bonded to bonding pads of the semiconductor element.

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Hirakata, Japan

Shuichi Murakami