Nihon Dempa Kogyo Co., Ltd.

Shuichi Mizusawa

Takehiro Takahashi

Masakazu Harada

Taichi Hayasaka

Ryoichi Ichikawa

Hiroaki Yamada

Yoshiaki Amano

Takumi Ariji

Kunio Morita

Kazuhiko Osawa

Kenzo Okamoto

A piezoelectric device includes a piezoelectric vibrating piece, a container, and a lid. The piezoelectric vibrating piece is bevel processed and has a bevel surface at one end of the piezoelectric vibrating piece. Thea container holds the piezoelectric vibrating piece with the bevel surface at the one end of the piezoelectric vibrating piece. The container has a connection pad at a holding region of the container and a pillow portion at a region corresponding to the other end of the piezoelectric vibrating piece. The lid member seals the container. The connection pad is buried in the container at the holding region in a state of a flat surface with a surface of the container and in a state where the surface of the connection pad is exposed. The piezoelectric vibrating piece is spanned between the surface of the connection pad and a top surface of the pillow portion.

Piezoelectric device

A surface mount type quartz crystal device includes a quartz crystal vibrating piece and a base plate. The quartz crystal vibrating piece is configured to vibrate at a predetermined frequency. The base plate is made of a crystal or a glass. The base plate includes an external electrode disposed on a bottom surface of the base plate to mount the quartz crystal device. The quartz crystal vibrating piece is placed on an opposite surface of the bottom face. The external electrode includes a metal film formed on a surface of the base plate by sputtering, and an electroless plating film formed on a surface of the metal film by electroless plating. The electroless plating film includes a nickel layer including lead and bismuth.

Quartz crystal device and method for fabricating the same

A piezoelectric device includes a piezoelectric vibrating piece, a base plate, and a lid plate. The base plate includes one principal surface where the piezoelectric vibrating piece is placed and includes a connecting electrode electrically connected to the extraction electrode, and another principal surface including a mounting terminal. The lid plate seals the vibrator. The lid plate seals the vibrator. At least a part of the mounting terminal includes a first metal film, a second metal film, and an electroless plating film. The second metal film is formed to cover the first metal film or is formed at a part of a surface of the first metal film. The second metal film has a different area from the first metal film. The electroless plating film is formed at least on a surface of the second metal film by electroless plating.

Piezoelectric device and method for fabricating the same

A piezoelectric vibrating device and a piezoelectric vibrating piece including an excitation unit, a framing portion and a connecting portion are provided. The excitation unit includes a first side extending in a first direction and a second side extending in a second direction. The connecting portion has a thickness of a first thickness in a third direction perpendicular to the first direction and the second direction. The excitation unit includes a first region, a second region and a third region. The pair of excitation electrodes are disposed on the first region. The second region with the first thickness is directly connected to the connecting portion. The third region is disposed between the first region and the second region. The third region has a thickness in the third direction of a second thickness. The second region has a thickness in the third direction that is thicker than the second thickness.

Piezoelectric vibrating piece and piezoelectric device

A piezoelectric vibrating piece includes a first extraction electrode and a second extraction electrode. The first extraction electrode is extracted from an excitation electrode formed on one principal surface to a framing portion via one principal surface of a connecting portion. The second extraction electrode is extracted from the extraction electrode formed on another principal surface to the framing portion via another principal surface of the connecting portion, a side surface of the connecting portion, and the one principal surface of the connecting portion. A distance between a first side and a second side at the framing portion is larger than a distance between the first side and the second side at the connecting portion. The first side is a side of the first extraction electrode at the second extraction electrode side. The second side is a side of the second extraction electrode at the first extraction electrode side.

A piezoelectric device includes a piezoelectric vibrating piece with a pair of excitation electrodes, a base plate, and a non-conductive bonding material. The base includes a pair of castellations that are hollowed into a side face from the mounting surface to the bonding surface. The pair of castellations include a first surface and a second surface. The first surface extends outward from the mounting surface toward the bonding surface side. The second surface extends outward from the bonding surface toward the mounting surface side. The second surface has a smaller area than an area of the first surface. A wiring electrode is disposed on the first surface, the second surface, and a side face of the bonding material. The wiring electrode is of a same electrode layer as the external electrode. The wiring electrode extends from the external electrode to the extraction electrodes.

Piezoelectric device and method for manufacturing the same

A piezoelectric vibrating piece is to be bonded to and sandwiched between a lid plate and a base plate with an external electrode. The piezoelectric vibrating piece has a first main surface at the lid plate side and a second main surface at the base plate side. The piezoelectric vibrating piece includes an excitation unit, a first excitation electrode, a second excitation electrode, a framing portion, one connecting portion, a first extraction electrode, and a second extraction electrode. The connecting portion includes a planar surface parallel to both the main surfaces and a side face intersecting with the planar surface. The first extraction electrode is extracted via the connecting portion. The second extraction electrode is extracted via the connecting portion. The first extraction electrode is disposed on at least a part of the side face of the connecting portion to be extracted to the framing portion.

Piezoelectric vibrating piece, piezoelectric device, and method for manufacturing piezoelectric device

A mesa-structure crystal element includes a circumferential portion having a thin thickness, a first convex portion formed on a plane in a center side from the circumferential portion and having a first height from the circumferential portion in a first principal face and a first planar shape, and a second convex portion formed in a center side from the circumferential portion and having a second height from the circumferential portion in a second principal face opposite to the first principal face and a second planar shape, wherein at least one of an area and a planar shape is different between the first planar shape of the first convex portion and the second planar shape of the second convex portion, or the first height of the first convex portion is different from the second height of the second convex portion.

Crystal element and crystal device

AT-cut quartz-crystal vibrating pieces and corresponding quartz-crystal devices are disclosed each having a vibrating portion surrounded by a frame portion across a through-slot configured to provide a wide vibrating portion. An exemplary vibrating piece has a quartz-crystal vibrating portion that vibrates when electrically energized, a frame portion surrounding the vibrating portion, and a through-slot defined between the vibrating portion and the frame portion. The through-slot includes a first through-slot extending in the X-axis direction along +Z'-edge of the vibrating portion, and a second through-slot extending in the X-axis direction along the &#x2212;Z&#x2032;-edge of the vibrating portion. The first through-slot has a different width than the second through-slot.

At-cut quartz-crystal vibrating pieces and devices, and methods for manufacturing same

Quartz-crystal vibrating devices are disclosed, including vibrating and frame portions separated by a through-slot. An edge surface of the slot has a protrusion preventing unwanted formation of artifact 'electrodes.' The vibrating portion and frame are made of AT-cut quartz as a unit. A joining portion couples the frame and vibrating portion together across the through-slot. A package base has two external electrodes. A third frame region has first and second plane surfaces. The protrusion projects toward the vibrating portion and has first and/or second sloped surfaces. First and second extraction electrodes extend from respective excitation electrodes via respective joining portions to respective external electrodes. The extraction electrodes pass across the first plane surface and first sloped surface or across the second plane surface and second slanted surface.

Quartz-crystal devices exhibiting reduced electrical impedance

The piezoelectric device () stores a piezoelectric vibrating piece () which vibrates whenever an electrical voltage is applied. The piezoelectric device comprises: a package lid () having a first peripheral surface (M) which surrounds a plane surface in a predetermined width; and a package base () comprising a second peripheral surface (M) bonded to the first peripheral surface of the package lid and a recess portion recessed from the second peripheral surface. The first peripheral surface of the package lid and the second peripheral surface of the package base are rough surfaces, respective metal films (AC, AC) are formed on each rough surface, and the package lid and the package base are bonded using a sealing material (LG) formed between the metal films.

Exemplary piezoelectric vibrating pieces have an excitation electrode and an extraction electrode having uniform thickness in the vibrating region to prevent unnecessary vibrations and degradation of vibration characteristics. An exemplary piezoelectric vibrating piece includes a vibrating portion having an excitation electrode of a first thickness (d), an outer frame surrounding the vibrating portion with a gap therebetween, a joining portion connecting the vibrating portion and the outer frame, and an extraction electrode connected to the excitation electrode and extending on the vibrating portion, joining portion, and outer frame. The extraction electrode has the first thickness dthroughout the vibrating portion and a second thickness (d&#x3e;d) on the outer frame.

Piezoelectric vibrating pieces and piezoelectric devices comprising same, and methods for manufacturing same

A piezoelectric device includes a piezoelectric vibrating piece, a base plate, which has a connecting electrode on one principal surface and a mounting terminal on another principal surface, in a rectangular shape, and a lid plate. The another principal surface of the base plate includes a pair of sides that face one another. At least the pair of sides has a level difference portion depressed toward the one principal surface side and a castellation passing through from the another principal surface to the one principal surface. A wiring electrode extracted from the mounting terminal to the one principal surface of the base plate is at a part of the level difference portion and the castellation. The wiring electrode and the mounting terminal include a metal film formed by sputtering or vacuum evaporation and an electroless plating film formed on the metal film by electroless plating.

Piezoelectric vibrating devices have piezoelectric vibrating pieces of which the vibration frequency is measurable individually on a wafer scale, without being affected by adjacent piezoelectric devices on the wafer. An exemplary piezoelectric device includes a piezoelectric vibrating piece having excitation electrodes and respective extraction electrodes. The device includes a package base with two connecting electrodes facing the vibrating piece and connected to respective extraction electrodes. Two pairs of mounting terminals are situated on the outer surface of the package base. Also on the outer surface of the package base are two pairs of opposing castellations that are recessed toward the center of the package base. Edge-surface electrodes connect the first and second main surfaces of the base; one pair is connected to the connecting electrodes and the other pair is connected to respective mounting terminals.

Piezoelectric devices and methods for manufacturing the same

The present disclosure provides a manufacturing method of a quartz-crystal device, in which its lid and base is manufactured with smaller thermal expansion coefficient between AT-cut quartz-crystal wafer. The method for manufacturing a quartz-crystal device comprises the steps of: preparing an AT-cut quartz-crystal wafer () having a plurality of frames, the frame includes an AT-cut vibrating piece having a first principal surface and an second principal surface, and an outer frame which surrounds the AT-cut vibrating piece for supporting the AT-cut frame; preparing a lid wafer () having a plurality of a lids; preparing a quartz-crystal base wafer () including a plurality of a base; and bonding the AT-cut quartz-crystal wafer, the quartz-crystal base wafer and the quartz-crystal lid wafer; wherein size of the AT-cut quartz-crystal wafer, the quartz-crystal base wafer and the quartz-crystal lid wafer are between three to four inches; and the quartz-crystal base wafer and the quartz-crystal lid wafer are cut at an angle between 24&#xb0;00' or more and 32&#xb0;28&#x2032; or less from crystallographic Z-axis.

Growing community of inventors

Saitama, Japan

Shuichi Mizusawa