3m Innovative Properties Company

Toyota Jidosha Kabushiki Kaisha

Minnesota Mining and Manufacturing Company

Shuichi Kitano

Takeshi Kondo

Osamu Ono

Yoshimasa Takeda

Akihiko Ishikawa

Satoshi Ishii

Ami Inoue

Tatsuya Nakamura

Masateru Komura

Shinobu Sato

Kotaro Shinozaki

Stefan Weigl

Koji Imai

Kiyoshi Ogata

Kazuyoshi Shiozaki

Tomohiro Koiwa

Gertrud A Klein

Conductive sticker

Conductive sheet

An adhesive/sealant which is curable by radiation exposure composition having at least one of adhesive and sealant properties and comprising a radiation polymerizable vinyl material, a polymerization initiator for radiation polymerization of the vinyl material, a thermosetting epoxy-containing material and a heat-activatable hardener for the epoxy-containing material.

Adhesive/sealant composition and bonded structure using the same

A composition comprises a curable epoxy-containing material, a first thermoplastic polyurethane component, a curative for the epoxy-containing material, and optionally, a second thermoplastic polyurethane component that is different than the first thermoplastic polyurethane component. The compositions are useful for sealing discontinuities in a substrate surface, especially those found in motor vehicles. Sealant articles and methods of sealing discontinuities are also disclosed.

Sealant composition, article and method

The invention relates to a pressure-sensitive thermosetting adhesive comprising from about 30% to about 80% by weight of a photopolymerizable prepolymeric or monomeric syrup containing an acrylic ester and a polar copolymerizable monomer, from about 20% to about 60% by weight of an epoxy resin or a mixture of epoxy resins containing no photopolymerizable groups, from about 0.5% to about 10% by weight of a heat-activatable hardener for the epoxy resin, from about 0.01% to about 5% of a photoinitiator, and from 0% to about 5% of a photocrosslinking agent. In a preferred embodiment, imidazoles and thermally expandable thermoplastic microspheres are utilized in the inventive adhesive formulation.

Epoxy-acrylate blend pressure-sensitive thermosetting adhesives

Growing community of inventors

Sagamihara, Japan

Shuichi Kitano