The Furukawa Electric Co., Ltd.

Shuichi Kitagawa

Kengo Mitose

Kazuo Yoshida

Kyota Susai

Takeo Uno

Yoshiaki Kobayashi

Akira Tachibana

Yoshiaki Ogiwara

Chikahito Sugahara

A metallic material for an electrical electronic includes a CU&#x2014;Sun alloy layer () provided on a conductive base (). A Cu concentration of the Cu&#x2014;Sn alloy layer gradually decreases from the base side to the surface () side.

Metal material for electrical electronic component

A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.

Terminal for connector and method of producing the same

A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer of Cu&#x2014;Sn. The alloy layer of Cu&#x2014;Sn has a concentration of Cu decreasing gradually toward a surface thereof. The metallic material for the connector includes the outermost surface layer formed of the alloy layer of Cu&#x2014;Sn. The alloy layer of Cu&#x2014;Sn has the concentration of Cu decreasing gradually toward the surface thereof.

Connector and metallic material for connector

A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass.

Composite material for electric/electronic part, production method thereof, and electric/electronic part

A metallic material for a connecting part, having a rectangular wire material of copper or a copper alloy as a base material, and formed at an outermost surface thereof, a copper-tin alloy layer substantially composed of copper and tin, wherein the copper-tin alloy layer of the outermost surface further contains at least one selected from the group consisting of zinc, indium, antimony, gallium, lead, bismuth, cadmium, magnesium, silver, gold, and aluminum, in a total amount of 0.01% or more and 1% or less in terms of mass ratio with respect to the content of the tin.

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Tokyo, Japan

Shuichi Kitagawa