Murata Manufacturing Co., Ltd.

Shuichi Kawata

Yuichi Kusano

Masahiko Shigaki

Takafumi Moriasa

Masatoshi Kakue

Atsushi Kishimoto

Tadamasa Miura

Hiroshi Nishikawa

Yuki Yamamoto

Yoshihiro Iwasaki

Kazuya Nakatera

Shinsuke Shichi

Yasutada Tanimoto

Norihiro Kawahara

Yoshiaki Katagiri

A multilayer wiring substrate according to the present invention includes a dielectric base body, a signal line in or on the dielectric base body, a ground conductor in the dielectric base body, and a graphite sheet in the dielectric base body. The dielectric base body is a laminate including dielectric sheets stacked on top of each other. The ground conductor and the signal line face each other in a stacking direction of the dielectric sheets. The ground conductor overlaps the signal line when viewed in plan in the stacking direction. The graphite sheet and the signal line face each other in the stacking direction without the signal line being located between the graphite sheet and the ground conductor. An upper surface of the graphite sheet is coplanar with an upper surface of the ground conductor or is located below the upper surface of the ground conductor.

Multilayer wiring substrate

A pump includes a pump flow path and electrodes and dielectric members in the pump flow path to allow a fluid to pass through the electrodes and the dielectric members in a flowing direction. The electrodes and the dielectric members are alternately stacked in the flowing direction so that a dielectric member is located between adjacent electrodes. Among the electrodes, an inter-electrode polarity of each pair of electrodes is different from that of an adjacent pair of electrodes. The dielectric members include a first dielectric member at a position of an odd-numbered dielectric member counted from the most upstream side of the flowing direction and a second dielectric member at a position of an even-numbered dielectric member counted from the most upstream side of the flowing direction. Material of the first and second dielectric members provide signs of a zeta potential opposite to each other.

Pump and cooling substrate

A cooling module includes an electroosmotic pump. The electroosmotic pump includes a first electrode which is permeable to a cooling fluid, a second electrode which is located with an interval from the first electrode and is permeable to the fluid, and a dielectric layer which is located between the first electrode and the second electrode and includes a microchannel which is permeable to the fluid. The first electrode and the second electrode have different polarities.

Cooling module and circuit board

A sound transmission system that includes a sound transmission device that is brought into contact with a human body and a sound signal generation device connected to the sound transmission device. The sound transmission device includes an insulator that is brought into contact with the human body, a conductor that is in contact with the insulator, and an input that is provided on the conductor and inputs a driving voltage. One end of the sound signal generation device is connected to the input, and the sound signal generation device supplies the driving voltage based on a sound signal to the sound transmission device.

Sound transmission device and sound transmission system

In order to further improve stress tolerance, a thermistor device includes a first base material member made of resin, a thermistor element including a thermistor thin film provided on a metal base material and first and second external electrodes provided on the thermistor thin film, and a first lead electrode and a second lead electrode provided on a principal surface of the first base material member, and connected to the first external electrode and the second external electrode. Each of the metal base material and the thermistor thin film undergoes a deflection between the first external electrode and the second external electrode.

Thermistor device

Growing community of inventors

Nagaokakyo, Japan

Shuichi Kawata