Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Shuichi Hirata

Satoshi Shida

Shoriki Narita

Shunji Onobori

Yasuharu Ueno

Shinji Kanayama

Shozo Minamitani

Makoto Morikawa

Akira Kugihara

Mamoru Nakao

Hiroshi Haji

Kanji Hata

Nobuhiko Muraoka

Kunio Oe

Takafumi Tsujisawa

Yoshitaka Etoh

Hirokuni Miyazaki

Tomoaki Nakanishi

Noriaki Yoshida

Takaharu Mae

Hiroyuki Yoshida

Shinjiro Tsuji

Nobuhisa Watanabe

Masaru Ichihara

Shinzo Eguchi

Shinya Marumo

Makoto Akita

Hironori Kobayashi

Yasuhiro Noma

Hirohisa Mozaki

Youhei Matsumoto

Masakazu Yamano

Kazuya Yamamoto

Kenichi Ishida

In a receiver for component feed plates for housing, in multi-stage stacks, a plurality of component feed plates with a plurality of components placed thereon, identification mark portions are formed so as to be placed at end portions or their proximities of support guide portions in a plate feed direction so that each paired set of support guide portions out of individual support guide portions can be distinguished from the other paired sets of support guide portions and moreover visually discerned in the plate feed direction.

Receiver for component feed plates and component feeder

In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Component mounting apparatus

A component mounting apparatus has a stagewith a fixed height position for holding a substrate, and a mounting headthat releasably holds a component, is moved downward toward the stagefrom a first reference height position HBfixedly positioned above the stage, and mounts the held componenton the substrateor an already mounted component. A controllerhas a mounting reference height calculation unitfor calculating a mounting reference height Hcorresponding to a distance from the first reference height position HB, and a first target movement height calculation unitfor calculating a first target movement height ZTAGbased on at least the mounting reference height Hand a thickness PTof the componentheld by the mounting head. The controllermoves the mounting headholding the componentdownward from the first reference height position HBto the first target movement height ZTAGto mount the held componenton the substrateor the already mounted component

Component mounting apparatus and component mounting method

According to the type of the plate placed in a plate placing device of a component feeder, appropriate holding operation and expanding operation are performed selectively and automatically according to the type of the plate by regulating the lowered position of a plate pressurizing member for the tray feeding plate to securely hold the plate and performing wafer expanding while securely holding the wafer feeding plate by releasing the regulation of the lowered position for the wafer feeding plate.

Component feeder

A suction nozzle () of a reversing head device () has a distal end surface () with a suction hole () opened therein, and a suction passage () communicated with the suction hole () at one end thereof. A portion of the distal end surface () outside of the suction hole () abuts against bumps () of an electronic component (). The suction hole () is opposed with a gap to a portion of a mounting side surface () where no bumps () are present. A vacuum pump () creates an air flow that flows from the gap between the suction hole () and the mounting side surface () into the suction passage () through the suction hole (). The electronic component () is held at the distal end surface () by a negative pressure generated by the air flow.

Component supply head device and component mounting head device

In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an expanding ring and a lower face of the wafer sheet and allows efficient and uniform processing. Moreover, setting the height position so as to avoid the contact between the wafer sheet and the upper end portion of the expanding ring at least when the slack removal processing is completed reliably prevents shrinking operation of the wafer sheet from being disturbed by the contact between the wafer sheet and the upper end portion.

Wafer expanding device, component feeder, and expanding method for wafer sheet

A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to slow down starting position where there is no risk that the electronic component makes contact with the substrate (S), and from there the head is lowered at low speed until a predetermined target contact load is detected. The process of lowering the head at low speed includes the steps of moving down the head a predetermined distance (S), measuring load after the step of moving down the head (S), and determining whether the measured contact load has reached the target contact load (S). The steps of moving down the head (S) and measuring the load (S) are repeated until the measured load reaches the target contact load. The actual load is precisely controlled to be close to a very small set level of target contact load. Accordingly, electronic components using low dielectric constant material are mounted without the risk of damage.

Method of controlling contact load in electronic component mounting apparatus

In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Component mounting method

In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.

Component feeding head apparatus, for holding a component arrayed

After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.

Apparatus and method for mounting electronic components

In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.

A component-mounted substrate moved to a specified substrate position by a substrate holding-and-moving device is delivered from a top of the substrate holding-and-moving device to a substrate discharge holder, and then while the substrate discharge holder is not moved, the substrate holding-and-moving device is moved to another substrate position, where a new substrate is received. Consequently, a later-executed movement operation for moving the new substrate to a substrate mounting region by the substrate holding-and-moving device, and a transfer operation for transferring the component-mounted substrate to an unloader unit by the substrate discharge holder, may be performed in parallel with each other without being influenced by each other's operation.

Substrate transportation apparatus, component mounting apparatus and substrate transportation method in component mounting operation

When an electronic component is picked up at an electronic component feeding part and then positioned and mounted at a predetermined mounting position on a transparent panel, mounting position marks formed at the mounting position on the transparent panel are registered with positioning marks formed on the electronic component, to thereby recognize the relative position from a surface opposite to a surface of the transparent panel where the electronic component is to be mounted, so that the position of the electronic component is corrected based on the result of the recognition before the electronic component is mounted at the predetermined mounting position on the transparent panel.

Method and apparatus for mounting electronic component

An apparatus, for applying a pressing tape to an object by applying pressure to the object, includes a pair of vertically movable members spaced at a certain interval. A tape-shaped material is traveled members and including a supporting tape carrying a pressing tape thereon. A pressure applying device is positioned between the movable members for pressing the tape-shaped member against an object. A tape feed-out device is provided upstream of one of the movable members for feeding out the tape-shaped material therefrom. A tape winding device is positioned downstream of the other movable member, for winding the tape-shaped material thereon. A tape feeding device is positioned between the other movable member and the winding device for feeding the tape-shaped material by a predetermined length by pulling the tape-shaped material. A first chuck is positioned on one movable member for chucking the tape-shaped material. A second chuck is positioned on the other movable member for chucking the tape-shaped material, and a third chuck device is provided for holding the tape-shaped material between the tape feeding device and the winding device.

Growing community of inventors

Osaka, Japan

Shuichi Hirata