Arisawa Mfg. Co., Ltd.

Shuichi Fujita

Makoto Tai

Kenji Nakamura

Takashi Miwa

Hiroyuki Matsuyama

Yoshihiko Konno

Takayuki Mayama

Kazuhide Kita

Hirokazu Hirai

A laminate comprising a substrate; and a plating-forming layer disposed on at least one surface of both surfaces of the substrate and containing a thermoplastic resin and a plating catalyst, wherein the plating-forming layer further satisfies conditions of the following (1) and/or (2),

Laminate

A laminate comprising a substrate; an adhesive layer formed on at least one surface of both surfaces of the substrate so as to be in direct contact with the substrate; and a plating layer formed on a surface of the adhesive layer opposite to the substrate, wherein the adhesive layer comprises a plating catalyst containing a precious metal, and a silane coupling agent.

Laminate and method for manufacturing the same

A method for manufacturing a flexible metal-clad laminated plate includes the steps of: (a) obtaining a laminated body by laminating a polyimide resin film including a non-thermoplastic polyimide layer and an adhesive layer containing thermoplastic polyimide, the adhesive layer being provided on at least one side of the non-thermoplastic polyimide layer, and a metal foil; and (b) subjecting the laminated body obtained in the step (a) to heat treatment under an inert gas atmosphere and a pressure of 0.20 to 0.98 MPa at a temperature of a glass transition temperature Tg of the thermoplastic polyimide&#x2212;20&#xb0; C. to the glass transition temperature Tg+50&#xb0; C.

Method for manufacturing flexible metal-clad laminated plate

An object of the present invention is to provide a flexible printed wiring board and multilayered flexible printed wiring board in which, in methods of laminating substrates comprising a non-adhering section and an adhering section, adhesion of the FPC substrates of the flexure part can be prevented and adequate flex resistance can be maintained. The present invention provides a flexible printed wiring board comprising at least an electric insulating layer and a conductor layer wherein the surface of the electric insulating layer has a 10-point average roughness of at least 1.5 &#x3bc;m and less than 2.0 &#x3bc;m and contact angle of at least 60&#xb0; and less than 120&#xb0;, or has a 10-point average roughness of at least 2.0 &#x3bc;m and less than 4.0 &#x3bc;m, and also provides a multilayered flexible printed wiring board formed by the lamination of two or more of the flexible printed wiring boards in which the surface of the electric insulating layers of the two or more flexible printed wiring boards exposed in a bendable state are opposing in a non-adhered state, and a part of the wiring boards is laminated on each of a first multilayered flexible printed wiring board and a second multilayered flexible printed wiring board.

Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board

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Niigata, Japan

Shuichi Fujita