E.i. Dupont De Nemours and Company

Dupont Dow Elastomers Inc.

Shuhong Wang

Christopher P Junk

Stephen E Burkhardt

Peter Anthony Fox

Ronald D Stevens

Curing fluoroelastomers with curing agents of formulas (I), (II), (III), and (IV): wherein each of R, R, R, R, R, R, R, and R, is selected from the group consisting of H; halogen atom; C1 to C4 alkyl groups in which the alkyl group is linear, branched, or cyclic; OR'; and aromatic groups;

Curing agents for fluoroelastomers

Cured perfluoroelastomers that contain high levels (i.e. greater than 50 phr) BaSOexhibit good thermal sealing performance such as reduced sticking and reduced tendency for splitting.

Cured perfluoroelastomer article

Peroxide curable fluoroelastomer compositions and articles made therefrom are disclosed. The compositions contain 5 to 45 weight percent, based on total weight of all fluoroelastomers present in the composition, of a blend of dynamically cured fluoroelastomer particles in an uncured fluoroelastomer. The compositions are unfilled, but have tensile properties adequate for many end use applications and are particularly useful as seals in semiconductor manufacturing equipment.

Peroxide curable fluoroelastomer compositions and articles made therefrom

Cured perfluoroelastomers that contain high levels (i.e. at least 65 phr carbon black) and 1 to 15 phr of a perfluoropolyether exhibit good resistance to explosive decompression while maintaining good sealing properties.

A non-black filled perfluoroelastomer composition comprising a) a perfluoroelastomer having nitrile group cure sites, b) a curative selected from the group consisting of i) a bis(aminophenol) and ii) a compound that decomposes at curing temperatures to generate ammonia and c) 1&#x2013;25 phr hydrophobic silica filler. Cured compositions have surprisingly better compression set than do similar compounds containing hydrophilic silica.

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Hockessin, DE, United States of America

Shuhong Wang