Shin-etsu Chemical Co., Ltd.

Semileds Corporation

Shuhei Ueda

Masaki Takeuchi

Yukio Shibano

Atsushi Watabe

Nobuaki Matsumoto

Yoshinori Ogawa

Kohei Otake

Keiji Ohori

Chen-Fu Chu

Kazunori Kondo

Toshiyuki Ozai

Taichi Kitagawa

David Trung Doan

Yi-Feng Shih

Shih-Kai Chan

Norio Nakamura

Daijitsu Harada

Harunobu Matsui

Masaki Tabata

Yuji Tokushige

Trung Tri Doan

Daisuke Kusabiraki

Satoru Miharada

Hideo Nakagawa

Hiroyuki Yamazaki

Yoichi Tanifuji

Makoto Ooura

Kento Tsukada

Provided is a substrate for transferring microstructures such as a micro LED including an engraved mark. The substrate for transferring microstructures is less likely to cause a recognizing error of the engraved mark to occur in a reading device, and makes it possible to stably and continuously read the engraved mark. A substrate for transferring microstructures includes a synthetic quartz glass substrate and a silicone pressure-sensitive adhesive agent layer provided on a front surface of the synthetic quartz glass substrate. The substrate includes an engraved mark provided in the from surface.

Substrate for transferring microstructures and method for manufacturing the same

A stamp head unit including: a stamp component including at least a silicone-based rubber film on a quartz glass substrate; a stamp-component-holding component including a surface having a hole for vacuum suction of a surface of the quartz glass substrate of the stamp component; and a tubular component having an evacuation suction hole connected to communicate with the hole for vacuum suction so as to maintain a vacuum, and being coupled and fixed with the stamp-component-holding component. This provides: a stamp component that can be fixed stably by a simple and convenient vacuum chuck system; a stamp head unit with which the stamp component can be replaced in a short time; and a microstructure-transfer apparatus provided with the stamp component and the stamp head unit.

Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component

A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate

Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate

An optical device package comprising a receptacle, an optical device received therein, and a window member disposed forward of the receptacle in a light emitting direction of the optical device. The window member is a member of synthetic quartz glass having front and back surfaces, at least one of the front and back surfaces being a rough surface.

Window member for optical device package, optical device package, making methods, and optical device-mountable package

A synthetic quartz glass substrate having front and back surfaces is worked by lapping, etching, mirror polishing, and cleaning steps for thereby polishing the front surface of the substrate to a mirror-like surface. The etching step is carried out using a hydrofluoric acid solution at pH 4-7.

Methods for working and sensing synthetic quartz glass substrate

A substrate is prepared by polishing a surface of the substrate using a polishing pad while feeding a slurry. The polishing pad has a porous nap layer which comes in contact with the substrate surface and is made of a base resin comprising at least three resins, typically an ether resin, ester resin, and polycarbonate resin. The polished substrate has a highly flat surface with a minimal number of defects.

Method of preparing substrate

Disclosed is a polishing agent for synthetic quartz glass substrates, which is characterized by containing a colloidal solution of a colloidal silica or the like having a colloid concentration of 20-50% by mass, and a polycarboxylic acid polymer, an acidic amino acid, a phenol or a glycosaminoglycan.

Polishing agent for synthetic quartz glass substrate

A used large-size photomask substrate having a patterned light-shielding film is recycled by (i) removing the light-shielding film from the used substrate to provide a photomask-forming glass substrate stock, (ii) resurfacing the glass substrate stock by sand blasting, (iii) repolishing the resurfaced glass substrate stock to yield a regenerated glass substrate stock, (iv) applying a light-shielding film onto the regenerated glass substrate stock to yield a regenerated photomask-forming blank, and (v) processing the light-shielding film of the blank into a pattern corresponding to a desired exposure of a mother glass, yielding a regenerated photomask substrate.

Recycling of large-size photomask substrate

A large-sized substrate having a diagonal length of not less than 500 mm and a ratio of flatness/diagonal length of not more than 6&#xd7;10is disclosed. By use of the large-sized substrate for exposure of the present invention, the exposure accuracy, particularly the register accuracy and resolution are enhanced, so that it is possible to achieve high-precision exposure of a large-sized panel. With the processing method according to the present invention, it is possible to stably obtain a large-sized photomask substrate with a high flatness, and since the CD accuracy (dimensional accuracy) at the time of exposure of the panel is enhanced, it is possible to perform exposure of a fine pattern, leading to a higher yield of the panel. Furthermore, by applying the processing method according to the present invention, it is also possible to create an arbitrary surface shape.

Large-sized glass substrate

A large-size glass substrate, from which a photomask substrate is formed, is prepared by processing a large-size glass substrate stock by (1) a flattening removal quantity based on height data of the substrate stock in the vertical attitude plus a deformation-corrective removal quantity. The deformation-corrective removal quantity is calculated from (2) a deflection of the substrate stock by its own weight in the horizontal attitude, (3) a deformation of the photomask substrate caused by chucking in an exposure apparatus, and (4) an accuracy distortion of a platen for supporting a mother glass.

Large-size glass substrate for photomask and making method, computer-readable recording medium, and mother glass exposure method

A large-sized substrate having a diagonal length of not less than 500 mm and a ratio of flatness/diagonal length of not more than 6.0&#xd7;10is disclosed. By use of the large-sized substrate for exposure of the present invention, the exposure accuracy, particularly the register accuracy and resolution are enhanced, so that it is possible to achieve high-precision exposure of a large-sized panel. With the processing method according to the present invention, it is possible to stably obtain a large-sized photomask substrate with a high flatness, and since the CD accuracy (dimensional accuracy) at the time of exposure of the panel is enhanced, it is possible to perform exposure of a fine pattern, leading to a higher yield of the panel. Furthermore, by applying the processing method according to the present invention, it is also possible to create an arbitrary surface shape.

Large-sized substrate and method of producing the same

A large-size substrate having improved flatness is prepared by measuring the flatness of one surface or opposite surfaces of a large-size substrate having a diagonal length of at least 500 mm, and partially removing raised portions on the one surface or opposite surfaces of the substrate by means of a processing tool on the basis of the measured data. The processing tool is adapted to blast a slurry of microparticulates in water carried on compressed air against the substrate.

Growing community of inventors

Joetsu, Japan

Shuhei Ueda