Kaneka Corporation

University of Hyogo

Shuhei Ozaki

Takahisa Iwahara

Tomokazu Tozawa

Kazuhiko Hirabayashi

Katsuya Ouchi

Tadashi Kokubo

Hiroshi Okoshi

Takao Manabe

Yuki Kawashima

Masamitsu Tachibana

Kazuaki Kanai

Hiroshi Ogoshi

Tetsuo Harada

Yasushi Kakehashi

Takeo Watanabe

Mitsuhiro Hori

Satoaki Iba

Ryoichi Narita

The present disclosure relates to a pellicle that can achieve both a high EUV transmittance and a uniformity in EUV transmittance by including a graphite thin film having a film thickness of 5 nm or more and 30 nm or less and a surface roughness (Sa) of 0.1 nm or more and 500 nm or less.

Pellicle comprising graphite thin film

A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 &#x3bc;m to 10 &#x3bc;m, the glass transition temperature of the cured resin body is 10&#xb0; C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of &#x2212;50 to 250&#xb0; C., a temperature elevation rate of 5&#xb0; C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180&#xb0; C. for 72 hours is 90% or more.

Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted light-emitting device

The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode

Growing community of inventors

Settsu, Japan

Shuhei Ozaki