Tdk Corporation

Sony Corporation

Sony Group Corporation

Shuhei Miyazaki

Kazuma Yamawaki

Yongfu Cai

Hiraku Hirabayashi

Kenzo Makino

Kazuya Watanabe

Norikazu Ota

Takeshi Matsui

Ikuo Yamano

Ryo Yokoyama

Kunihiro Ueda

Takeshi Ogita

Seiji Muramatsu

Koichi Otani

Yoshio Saito

Ayumi Kato

Ryoko Amano

Taku Tomita

Risa Takahashi

Yugo Takeda

Hiromi Fukaya

Masayuki Sagano

Kanna Tominaga

Saki Nishihara

A magnetic sensor device includes a sensor substrate and a sensor element circuitry. The sensor substrate has a surface. The sensor element circuitry is provided on the surface of the sensor substrate and includes one or more magnetic sensor elements. As viewed in a plane parallel to the surface, the sensor substrate has a perimeter that is substantially octagonal. The perimeter includes two short sides opposed to each other, two long sides opposed to each other, and four corners. The four corners are each chamfered entirely or partially in a thickness direction that is substantially orthogonal to the surface. A ratio of a length of each of the four corners along each of the two long sides of the sensor substrate to a length of each of the two long sides of the sensor substrate is less than or equal to 0.39.

Magnetic sensor device

In an assembly in which a space between two elements is filled with a filler containing resin, a configuration that can limit both the size of the assembly and the cost of the fillers is provided. An assembly of stacked elements has: first element having first surface; resin layer that is arranged on first surface and that contains a plurality of fillers; and second element that is arranged on resin layer and that has second surface that is in contact with resin layer. In a section that is perpendicular to second surface, the average flattening ratio of fillers that are in contact with second surface is larger than the average flattening ratio of fillers that are not in contact with second surface. Here, the flattening ratio is a ratio of the maximum length of the filler in a direction parallel to second surface to the maximum thickness of the filler in a direction perpendicular to second surface.

Method of producing assembly of stacked elements having resin layer with fillers

An information processing device includes an emotion recognition unit, a facial expression output unit, and an avatar composition unit. The emotion recognition unit recognizes an emotion on the basis of a speech waveform. The facial expression output unit outputs a facial expression corresponding to the emotion. The avatar composition unit composes an avatar showing the output facial expression.

Information processing device, information processing method, and program

An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed therebetween. The second plated layer covers the second surface. The second electronic component chip is provided on the second plated layer with a second insulating layer being interposed therebetween. The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag).

Electronic component package

A lead frame includes a die pad, a plurality of leads, at least one support lead, and a frame member. The frame member includes two first connection bars and two second connection bars. The plurality of leads include a plurality of specific leads. The plurality of specific leads are each connected to the first connection bar. At least one of the specific leads is connected to the second connection bar via the at least one support lead. The cross-sectional second-order moment of a cross section of the at least one support lead perpendicular to a Y direction around an X axis is equal to or more than the cross-sectional second-order moment of a cross section of the at least one support lead perpendicular to an X direction around a Y axis.

Lead frame and electronic component

A magnetic sensor device includes a first chip including a first magnetic sensor, a second chip including a second magnetic sensor and a third magnetic sensor, and a support having a reference plane. The first magnetic sensor includes at least one first magnetic detection element, and detects a first component of an external magnetic field. The second magnetic sensor includes at least one second magnetic detection element, and detects a second component of the external magnetic field. The third magnetic sensor includes at least one third magnetic detection element, and detects a third component of the external magnetic field. The first chip and the second chip are mounted on the reference plane.

Magnetic sensor device and magnetic sensor system

Assembly of stacked elements and method of producing the same

A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.

An information processing apparatus capable of controlling vibration in accordance with a situation in a case where the vibration is generated on the basis of an audio signal. The information processing apparatus can include: a vibrator; and a controller configured to detect a state of the information processing apparatus and control a state of the vibrator based on a detection result, in which the controller controls vibration the vibrator in accordance with reproduction of content while the content is being reproduced in the information processing apparatus, and, in a case where a predetermined condition is satisfied, restricts vibration of the vibrator even while the content is being reproduced in the information processing apparatus.

Information processing apparatus, information processing method, and computer program product for controlling vibration

In an assembly in which a space between two elements is filled with a filler containing resin, a configuration that can limit both the size of the assembly and the cost of the fillers is provided. Assemblyof stacked elements has: first elementhaving first surface; resin layerthat is arranged on first surfaceand that contains a plurality of fillers F; and second elementthat is arranged on resin layerand that has second surfacethat is in contact with resin layer. In a section that is perpendicular to second surface, the average flattening ratio of fillers Fthat are in contact with second surfaceis larger than the average flattening ratio of fillers F, Fthat are not in contact with second surface. Here, the flattening ratio is a ratio of the maximum length of the filler in a direction parallel to second surfaceto the maximum thickness of the filler in a direction perpendicular to second surface

A magnetic sensor device comprises a magnetic sensor chip that has a substantially rectangular shape and that contains a magnetic sensor element; and a sealing body, which is composed of a resin material containing magnetic particles and that integrally seals the chip. The chip includes a first and second side surfaces which are mutually opposite to each other, and a third and fourth side surfaces which are mutually opposite to each other and orthogonal to the first and second side surfaces. The sealing body contains first to forth sealing parts. The thicknesses of the first and second sealing parts are smaller than the particle diameter of the particles, and the thickness of at least the third sealing part is larger than the particle diameter of the particles. The particles exist in at least the third sealing part and substantially do not exist in the first and second sealing parts.

Growing community of inventors

Tokyo, Japan

Shuhei Miyazaki