Ngk Insulators, Inc.

Shuhei Ishikawa

Nobuaki Nakayama

Tsutomu Mitsui

Takahiro Ishikawa

Ken Suzuki

Seiji Yasui

Hiroyuki Takeuchi

Makoto Miyahara

Masayuki Shinkai

Masahiro Kida

Tadashi Otagiri

Takaharu Iwadachi

Tomio Suzuki

Naoki Sakamoto

Satoru Kawai

Kazuyoshi Inoue

Hiroyuki Hiramitsu

Kazumasa Yashiro

Yoshihisa Ishiguro

Yosuke Matsui

A heat spreader module is composed of a joined assembly, including a plate member, an insulating board disposed on the plate member, and a circuit board disposed on the insulating board. An IC chip is mounted on an upper surface of the joined assembly, or stated otherwise, on an upper surface of the circuit board, with a solder layer interposed therebetween. A heat sink is joined by a solder layer, for example, onto a lower surface of the joined assembly, or stated otherwise, onto a lower surface of the plate member, thereby making up a heat sink module.

Heat spreader module and method of manufacturing same

A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 &#x3bc;m when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 &#x3bc;g/cm.

Heat spreader module

A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600&#xb0; and 900&#xb0; C. for 10 minutes.

A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate using a hard brazing member containing an active element and removing unnecessary conductive layer portions adjacent a metal circuit pattern of the metal plate to at least partially expose a portion of the surface of the insulating substrate.

Method for producing a circuit board

A composite material includes an SiC porous ceramic sintered body, which is formed by preliminarily sintering a porous body, having a coefficient of thermal expansion lower than the coefficient of thermal expansion of copper to construct a network therein. A copper alloy impregnating the porous ceramic sintered body includes copper and one or more additive elements which are prepared to impart a coefficient of thermal conductivity of 160 W/mK or higher to the composite material. The additive elements include up to 5% of at least one element selected from Be, Al, Si, Mg, Ti, Ni, Bi, Te, Zn, Pb, Sn, and mish metal, and also contain unavoidable impurities and gas components.

Composite material

Graphite is placed in a case, and the case is set in a furnace. The interior of the furnace is subjected to sintering to produce a porous sintered member of graphite. After that, the case with the porous sintered member therein is taken out of the furnace, and is set in a recess of a press machine. Subsequently, molten metal of metal is poured into the case, and then a punch is inserted into the recess to forcibly press the molten metal in the case downwardly. Open pores of the porous sintered member are infiltrated with the molten metal of the metal by the pressing treatment with the punch.

Heat sink material and method of manufacturing the heat sink material

A mass of graphite is placed into a case, and the case is put into a furnace (step S). The space in the furnace is heated to produce a porous sintered body of graphite (step S). Thereafter, the case with the porous sintered body contained therein is removed from the furnace, and put into a cavity in a press (step S). Then, a molten mass of a metal is poured into the case (step S), and a punch is inserted into the cavity to press the molten metal into the porous sintered body in the case (step S).

Heat sink material

A member for use in an electronic circuit has a thermally conductive layer mounted on a heat sink. The thermally conductive layer comprises an insulating substrate, a first joint member joining the insulating substrate to the heat sink and containing an active element, a second joint member disposed on the insulating substrate, and an electrode disposed on the second joint member. The insulating substrate comprises an AlN layer or an SiNlayer. Each of the first and second joint members is made of a hard brazing material containing an active element. The heat sink is made of an SiC/Cu composite material or a C/Cu composite material.

Member for electronic circuit, method for manufacturing the member, and electronic part

A high-pressure vessel is allowed to be in an initial state, and a first chamber is disposed downward. Copper or copper alloy is placed in the first chamber, and SiC is set in a second chamber. The high-pressure vessel is tightly sealed, and then the inside of the high-pressure vessel is subjected to vacuum suction through a suction pipe. An electric power is applied to a heater to heat and melt the copper or copper alloy in the first chamber. At a stage at which the molten copper in the first chamber arrives at a predetermined temperature, the high-pressure vessel is inverted by 180 degrees to give a state in which SiC is immersed in the molten copper. An impregnating gas is introduced into the high-pressure vessel through a gas inlet pipe to apply a pressure to the inside of the high-pressure vessel. Thus, SiC is impregnated with the molten copper. The high-pressure vessel is inverted by 180 degrees, and then the impregnating gas in the high-pressure vessel is discharged through a gas outlet pipe, simultaneously with which a cooling gas is introduced into the high-pressure vessel through the gas inlet pipe to cool the high-pressure vessel.

Composite material for heat sinks for semiconductor devices and method for producing the same

A substrate material ( ) for printed circuit, comprising a sheet-shaped composite material ( ) composed of a plastic and a ceramic and conductive metal wires ( ) fixed in the composite material ( ) at given pitches, wherein the two surfaces of the substrate material ( ) have electrical connection to each other via the metal wires ( ). A process for producing a substrate material for printed circuit, which comprises stretching, in a mold, conductive metal wires at given pitches, then pouring, into the mold, a composite material composed of a plastic and a ceramic, curing the composite material, thereafter slicing the resulting material in a direction approximately perpendicular to the direction of the metal wires. Good electrical connection can be secured, and it is possible to prevent, during use, peeling between substrate material and conductive layers and between insulating material and metal wires. A printed circuit board of high density and excellent dimensional accuracy can be obtained.

Printed circuit board material and method of manufacturing board material and intermediate block body for board material

Composite material for heat sinks for semiconductor devices and method

Beryllium-copper alloy excellent in strength, workability and heat

A member for securing conduction for being placed between connecting elements of a connector has a sheet made of an insulating, elastic material and at least one conductive chip embedded in said sheet. The sheet is made electrically conductive between both surfaces by means of said at least one conductive chip. Since the member for securing conduction has a sheet made of an insulating, elastic material and at least one conductive chip embedded in the sheet, the member for securing conduction is applicable to both a flat conductive surface and a curved conductive surface. The member for securing conduction can easily correspond with various sizes of connectors and has a sufficient durability to be repeatedly used.

Member for securing conduction and connector using the member

A process for producing beryllium-copper alloys is disclosed, which comprises the steps of obtaining a cast ingot by melting an alloy essentially consisting of from 0.05 to 2.0% by weight of Be, form 0.1 to 10.0% by weight of at least one kind of Co and Ni, and the balance being substantially Cu, subjecting the thus obtained cast ingot to a solution treatment at a temperature range from 800.degree. to 1,000.degree. C., cold working, annealing at a temperature range from 750.degree. to 950.degree. C. being lower than the solution treating temperature, and then an age hardening treatment. The alloy may further contain from 0.05 to 4.0% by weight of at least one kind of Si, Al, Mg, Zr, Sn, and Cr in a total amount. By this producing process, the beryllium-copper alloys having higher strength and formability can be otained due to uniform and fine dispersion of solid-unsolved precipitate.

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Handa, Japan

Shuhei Ishikawa