Innolux Corporation

Shuhei Hosaka

Chun-Hsien Lin

An electronic device includes a first substrate having a first surface and a first side-surface adjacent to the first surface, a first electronic element and a second electronic element disposed on the first surface of the first substrate, a first conductive wire and a second conductive wire disposed on the first surface, and a first side conductive wire and a second side conductive wire disposed on the first side-surface. The first conductive wire is electrically connected to the first electronic element, and the second conductive wire is electrically connected to the second electronic element. The first side conductive wire is electrically connected to the first conductive wire, the second side conductive wire is electrically connected to the second conductive wire, and a width of the first side conductive wire along a direction is different from a width of the second side conductive wire along the direction.

Electronic device having side conductive wire

An electronic device includes a first substrate, a first conductive element, a second conductive element and a circuit board. The first substrate has a first surface, a first side surface and a second surface. The first side surface is connected between the first surface and the second surface. The first conductive element is disposed on the first surface of the first substrate. The second conductive element is electrically connected to the first conductive element. The second conductive element includes a first part and a second part. The first part is disposed on the first side surface of the first substrate, the second part is disposed on the second surface of the first substrate, and the first part is connected to the second part. The circuit board is disposed on the second surface of the first substrate and electrically connected to the second part of the second conductive element.

Electronic device including conductive element on side surface of substrate

An embodiment of the disclosure provides an electronic device including multiple units. Each unit in the units includes multiple primary bonding regions and at least one reserved bonding region. Each reserved bonding region is connected to the primary bonding regions. The number of the at least one reserved bonding region is less than the number of primary bonding regions.

Electronic device

An electronic device includes a first substrate including a first surface and a first side-surface adjacent to the first surface, a second substrate including a second surface and a second side-surface adjacent to the second surface, a plurality of first conductive wires disposed on the first surface, a plurality of dam walls disposed on the first surface and located between any adjacent two of the first conductive wires respectively and a plurality of second conductive wires disposed on the first side-surface and the second side-surface. The plurality of first conductive wires are electrically connected to the plurality of second conductive wires respectively.

Electronic device dam walls located between two adjacent conductive wires

An electronic device includes a first substrate, a second substrate, a first conductive element, a second conductive element and a third conductive element. The first substrate has a top surface and a first side surface. The second substrate is oppositely disposed on the first substrate and has a second side surface parallel to the first side surface. The first conductive element and the third conductive element are disposed on the top surface of the first substrate. The second conductive element is disposed on the first side surface of the first substrate and the second side surface of the second substrate. The third conductive element contacts the first conductive element to define a first contact area, the third conductive element contacts the second conductive element to define a second contact area, and the first contact area is greater than the second contact area.

A method of manufacturing an electronic device is provided, wherein the method includes the following steps. A first substrate is provided, wherein the first substrate has a top surface and a side surface. A first wire is formed on the top surface of the first substrate. An auxiliary bonding pad is formed on the top surface of the first substrate, and the auxiliary bonding pad contacts the first wire. A second wire is formed on the side surface of the first substrate, and the second wire contacts the auxiliary bonding pad. The second wire and the auxiliary bonding pad include at least one same material.

Electronic device including wire on side surface of substrate and manufacturing method thereof

An electronic device includes a substrate having a top surface, a bottom surface and a side surface between the top surface and the bottom surface, and a test circuit disposed on the substrate. The test circuit extends from the top surface to the bottom surface through the side surface of the substrate and has a current terminal for an ammeter and a voltage terminal for a voltmeter, both of which are disposed on the bottom surface.

Tiled display device with a test circuit

The present disclosure includes an electronic device including a wiring structure, the wiring structure includes a first wiring pattern including a plurality of first input wires and a plurality of first output wires, a second wiring pattern including a plurality of second bridge wires, one second bridge wiring crosses at least one of the plurality of first input wires or at least one of the plurality of first output wires, and a first insulating layer disposed between the first wiring pattern and the second wiring pattern, the plurality of first input wires are electrically connected to the first output wires through the second bridge wires.

Growing community of inventors

Miao-Li County, Taiwan

Shuhei Hosaka