Applied Materials, Inc.

Shuchivrat Datar

Thomas H Osterheld

Shou-Sung Chang

Paul D Butterfield

Jun Qian

Charles C Garretson

Haosheng Wu

Hari N Soundararajan

Eric Lau

Chad Pollard

King Yi Heung

Jonathan Paul Domin

Dmitry Sklyar

Calvin Lee

David Chui

A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system. The control system causes the valve to open and close in accordance with a steam delivery schedule in a recipe, receive a measured value for the steam parameter from the sensor, receive a target value for the steam parameter, and perform a proportional integral derivative control algorithm with the target value and measured value as inputs so as to control the first valve and/or a second pressure release valve and/or the heating element such that the measured value reaches the target value substantially just before the valve is opened according to the steam delivery schedule.

Control of steam generation for chemical mechanical polishing

A method for polishing dies locations on a substrate with a polishing module. A thickness at selected locations on the substrate is premeasured at a metrology station, each location corresponding to a location of a single die. The thickness obtained by the metrology station for the selected locations of the substrate is provided to a controller of a polishing module. The thickness corrections for each selected location on the substrate are determined. A polishing step in a polishing recipe is formed from the thickness correction for each selected location. A polishing parameter for each die location is calculated for the recipe.

Chemical mechanical polishing automated recipe generation

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Santa Clara, CA, United States of America

Shuchivrat Datar