Future Wei Technologies, Inc.

Shuangfu Wang

Shiqun Gu

Jun Xia

Hongquan Sun

Wangsheng Xie

Hongying Zhang

Liming Zhao

Jinghua Zhu

Hong Tao Liu

Hong Liu

An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.

Merged power pad for improving integrated circuit power delivery

Growing community of inventors

Shanghai, China

Shuangfu Wang