Huawei Technologies Co., Limited

Shuainan Lin

Guo Yang

Linfang Jin

Quanming Li

Jiajia Sui

Zaizhong Xia

Yuening Li

Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.

Wireless charging device

An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.

Heat dissipation structure for electronic device and electronic device

A heat dissipation apparatus, including a base plate, a guide fin group, and a heat dissipation fin group, where the guide fin group is formed on a surface of the base plate, the guide fin group is disposed with at least two guide fins that are disposed at an interval, and the at least two guide fins extend along a surface of the base plate from an edge of the base plate, and a flow path for flowing of an airflow is formed between two adjacent guide fins, and the heat dissipation fin group includes at least one heat dissipation fin, where the at least one heat dissipation fin is fixedly connected to the top of the at least two guide fins to dissipate heat of the at least two guide fins. The heat dissipation apparatus further includes, guide fins and a stopper fin.

Growing community of inventors

Shenzhen, China

Shuainan Lin