Shuaib Badat

Justin Eugene Evans

Cody Hubman

Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling method includes pumping a working fluid with an electro-osmotic (EO) pump through a fluid circuit; collecting a gas produced from the operation of the EO pump upon the working fluid—the collection of gas inducing a saturation of the gas in the fluid circuit; and radiating heat from the working fluid via a heat exchanger. In some embodiments, the method involves providing a core having channels for transporting the working fluid, and placing the core in thermal communication with electronic components that generate heat. The core is placed in fluid communication with the EO pump. In certain embodiments, the core, EO pump, gas collector, and heat exchanger are coupled to provide a substantially leak proof system that does not allow gas molecules to escape from the fluid circuit.

Cooling system and methods

Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling system includes a pump coupled to one or more gas accumulators, a heat exchanger, and a core. In some embodiments, the cooling system further includes a cover coupled to the core with an interference fit, which can be (for example) a thermal fitting. In certain embodiments, the core includes surface channels for transporting a working fluid. In one embodiment, the cover is configured to cover the surface channels. In some embodiments, the gas collectors, pump, and heat exchanger are mounted on a surface of the core that is opposite to a surface of the core covered by the cover.

Growing community of inventors

Century, South Africa

Shuaib Badat