Shuaib Badat

Justin Eugene Evans

Cody Hubman

Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling system includes a core having a plurality of surface channels configured to facilitate the transport of a working fluid. The cooling system can include a cover configured to cover the surface channels, and further configured to couple to the core to form a leak proof seal with an interference fit. In some embodiments, the interference fit can be the result of a thermal fitting. The core can be a metal core printed circuit board. The core can be configured to be in thermal communication with a printed circuit board. In certain embodiments, the surface channels are in communication with a fluid inlet and a fluid outlet; the fluid inlet and the fluid outlet can be placed on a side of the core opposite a side of the core having the surface channels.

Cooling system and methods

Disclosed are systems and methods for cooling. In one embodiment, a cooling system can include an electro-osmotic (EO) pump operationally coupled, in a fluid circuit, to a heat exchanger and to one or more gas collectors. In some embodiments, the EO pump can be coupled to a gas collector with a thermal fitting. In certain embodiments, the heat exchanger can be coupled to the EO pump and to the second gas collector with thermal fittings. In one embodiment, the cooling system can be used to facilitate cooling, for example, a printed circuit board.

Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling system includes a pump coupled to a gas accumulator. The pump can be operationally coupled to a heat exchanger in a fluid circuit. The gas accumulator can be coupled to a core. In some embodiments, the pump is an electro-osmotic pump, and the core is a metal core printed circuit board. In certain embodiments, the gas accumulator is coupled to the pump with a thermal fitting. In one embodiment, the pump, gas accumulator, and heat exchanger are mounted on a surface of the core.

Disclosed are systems and methods for cooling electronic devices. In one embodiment, a method of manufacturing a cooling system includes providing a core having open, fluid channels on a first core side; providing a cover configured to cover the channels, and the cover further configured to couple to the core to form a leak proof seal. In some embodiments, a leak proof seal can be obtained through an interference fit. In certain embodiments, a leak proof seal can be obtained through a thermal fitting. In one embodiment, the core is shrank through cooling and then placed inside the cover. In some embodiments, the cover is expanded through heating and the core is placed inside the cover. In certain embodiments, the core is a metal core printed circuit board. In one embodiment, an electro-osmotic pump, a gas accumulator, and a heat exchanger can be operationally coupled to the channels.

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Century City, South Africa

Shuaib Badat