Industrial Technology Research Institute

Intellectual Property Innovation Corporation

Shu-Tang Yeh

Jing-Yi Yan

Kuang-Jung Chen

Jia-Chong Ho

Jane-Hway Liao

Hong-Ming Dai

Yen-Ching Kuo

Hung-Yi Chen

Tien-Shou Shieh

Chen-Wei Lin

Chih-Chieh Hsu

Chien-Chang Hung

Miao-Tsai Chu

Jian-Lin Wu

Ping-I Shih

Kung-Yu Cheng

Mei-Rurng Tseng

Heh-Lung Huang

Yi-Hsiang Huang

Yen-Shih Huang

Sheng-Wei Chen

Mei-Ru Lin

Jung-Jie Huang

Chia-Hao Tsai

Wen-Lung Chen

Hung-Chien Lin

Yung-Sheng Wang

Kuo-Hui Shen

I-Ho Shen

An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.

Heater package

The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.

Electronic device

A package of photoelectric device including a substrate, at least one photoelectric device, a first barrier layer, a wavelength-converting layer, and a second barrier layer is provided. The photoelectric device is disposed on the substrate. The first barrier layer is disposed on the substrate and covers the photoelectric device. The wavelength-converting layer is disposed on the first barrier layer. The second barrier layer covers the wavelength-converting layer. A composition of the first barrier layer includes a nitrogen content of more than 0 atomic percent (at %) to 10 at %, an oxygen content of 50 at % to 70 at %, and a silicon content of 30 at % to 50 at %.

Package of photoelectric device

A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5&#xd7;10gram/cm.

Environmental sensitive element package and encapsulation method thereof

A package structure of an electronic device is provided. The substrate of such package structure has at least one embedded gas barrier structure, which protects the electronic device mounted thereon and offers good gas barrier capability so as to extend the life of the electronic device.

Electronic device package structure and manufacturing method thereof

A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.

Package structure of electronic device

An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.

Environmental sensitive electronic device package and manufacturing method thereof

A package of an environmental sensitive electronic element including a first substrate, a second substrate, an environmental sensitive electronic element, a flexible structure layer and a filler layer is provided. The environmental sensitive electronic element is disposed on the first substrate and located between the first substrate and the second substrate. The environmental sensitive electronic element includes an anode layer, a hole injecting layer, a hole transporting layer, an organic light emitting layer, a cathode layer and an electron injection layer. The flexible structure layer is disposed on the environmental sensitive electronic element and includes a soft layer, a trapping layer and a protective layer. The material of the trapping layer is the same as the material of the electron injection layer. The filler layer is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive electronic element and the flexible structure layer.

Package of environmental sensitive electronic element

A double-side light emitting display panel includes a substrate, a plurality of top emission pixel structures and a plurality of bottom emission pixel structures. The top emission pixel structures are disposed on the substrate, and the bottom emission pixel structures are disposed on the substrate. The top emission pixel structures and the bottom emission pixel structures are arranged alternatively on the substrate.

Double-side light emitting display panel

A light emitting device includes a substrate, and a plurality of light emitting structures disposed thereon. Each of the light emitting structures includes an auxiliary electrode disposed on the substrate, a first insulating layer disposed on the substrate and covering the auxiliary electrode, an electrode disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and having a first opening exposing the electrode, an organic light emitting layer disposed in the first opening, a cathode disposed on the organic light emitting layer, at least a conductive structure penetrating through the first insulating layer and the second insulating layer, and a closed ring structure disposed on the second insulating layer and around the cathode, wherein a thickness of the closed ring structure is larger than that of the cathode.

Light emitting device

A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.

Fabrication method of substrate

A package of an environmental sensitive element including a flexible substrate, an environmental sensitive element, a flexible sacrificial layer and a packaging structure is provided. The environmental sensitive element is disposed on the flexible substrate. The flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element includes a plurality of first thin films and the flexible sacrificial layer includes a plurality of second thin films. The bonding strength between two adjacent second thin films is substantially equal to or lower than the bonding strength between two adjacent first thin films. Further, the packaging structure covers the environmental sensitive element and the flexible sacrificial layer.

Package of environmental sensitive element

A packaging method of an organic light emitting diode (OLED) is described. First, a substrate is provided, and the substrate has the OLED device formed thereon. Thereafter, at least one protection layer is formed on the substrate, so as to cover the peripheral sidewall of the OLED device entirely. The step of forming the protection layer includes forming an organic layer on the substrate, and then forming a metal layer on the organic layer, wherein the metal layer at least covers a sidewall of the OLED device. Afterwards, an oxidation treatment is performed, so as to oxidize a portion of the metal layer.

Apparatus of organic light emitting diode and packaging method of the same

A light-emitting device and a method for manufacturing the same are provided. The light-emitting device comprises a substrate, a light-emitting element and a light-electricity-transforming element. The substrate has a first region and a second region which are non-overlapping. The light-emitting element is disposed over the substrate and located in the second region. The light-electricity-transforming element is disposed over the substrate and located in the first region. At least a portion of a side wall of the light-electricity-transforming element corresponds to at least a portion of a side wall of the light-emitting element, so that at least a side light from the light-emitting element is received and transformed into an electricity power by the light-electricity-transforming device.

Light-emitting device and method manufacturing the same

An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.

Growing community of inventors

Taichung County, Taiwan

Shu-Tang Yeh