Mediatek Corporation

Cambrios Film Solutions Corporation

Shu-Ping Hsu

Chia-Yang Tsai

Chung-Chin Hsiao

Siou-Cheng Lien

Jui-Hsi Cheng

Tsung-Liang Lin

Yi-Huei Chen

Tai-Yuan Cheng

Yi-Wen Chiu

A photosensitive electrically conductive structure includes: a substrate; a releasing photosensitizing resin layer disposed on the substrate; a nano silver layer disposed on the releasing photosensitizing resin layer; and a photosensitive electrically conductive layer disposed on an edge of the nano silver layer. A visible region is defined in the photosensitive electrically conductive structure where the nano silver layer is not covered by the photosensitive electrically conductive layer and a peripheral wiring region is defined in the photosensitive electrically conductive structure where the nano silver layer is covered by the photosensitive electrically conductive layer. The releasing photosensitizing resin layer has an average molecular weight (Mn) greater than 3,000 but less than 100,000, and the releasing photosensitizing resin layer, the nano silver layer, and the photosensitive electrically conductive layer are patterned. A touch sensor includes at least one layer of the photosensitive electrically conductive structure.

Photosensitive electrically conductive structure and touch sensor

An electrode structure and a touch panel including the electrode structure are provided. The electrode structure includes a membrane layer and a metallic nanowires layer having metallic nanowires. A first portion of the metallic nanowires layer is covered by the membrane layer, and a second portion of the metallic nanowires layer is exposed out of the membrane layer. The membrane layer is made of a copolymer formed by mixing two or more materials having different functional groups.

Electrode structure and touch panel thereof

An apparatus for providing a multi-mode interface between a baseband receiver and radio frequency (RF) circuitry. According to a preferred embodiment of the invention, the apparatus includes a first differential-to-single-ended converter, a second differential-to-single-ended converter and an analog-to-digital converter. The first differential-to-single-ended converter receives an incoming differential current pair to be converted into a first single-ended voltage signal. The second differential-to-single-ended converter receives an incoming differential voltage pair to be converted into a second single-ended voltage signal. Further, the analog-to-digital converter selectively receives an incoming single-ended voltage signal, the first single-ended voltage signal, or the second single-ended voltage signal to be converted into a digital signal to be further processed by the baseband processor. Note that the incoming single-ended voltage signal, as well as the incoming differential voltage and current signal pairs together form the multi-mode interface to the RF circuitry.

Apparatus for providing a multi-mode interface between a baseband receiver and radio frequency circuitry

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Hsinchu, Taiwan

Shu-Ping Hsu