The University of Tokyo

Kawasaki Jukogyo Kabushiki Kaisha

Mitsubishi Heavy Industries Limited

Mistubishi Heavy Industries, Ltd.

Shu Minakuchi

Nobuo Takeda

Toshio Abe

Takayuki Shimizu

Nozomi Saito

Yuji Ikeda

Yutaka Terada

Hiroaki Tsutsui

Keigo Uhira

Tadahito Mizutani

Junichi Kimoto

Noriyoshi Hirano

Takuya Ishida

Hiroshi Mamizu

A monitoring system according to one aspect of the present disclosure includes: a sensor to measure physical quantities at one or a plurality of measurement points of a structural body; processing circuitry configured to acquire measured values from the measurer; a memory to store the measured values acquired from the measurer; and a data storage that, when one or some of the measured values stored in the memory satisfy a predetermined trigger condition, and as a result, it is determined that the structural body has received impact, records a group of data of the measured values which are within a certain time range and include the measured value based on which it is determined that the trigger condition is satisfied.

Monitoring system for measuring physical quantities at measurement points of structural body, aircraft, and monitoring method

A bonded structure includes a first fiber part () and a second fiber part () arranged between a first member () and a second member (). The first fiber part () and the second fiber part () are bonded so as to connect the first member () and the second member () to each other. The first fiber part () and the second fiber part () are arranged so that the fibers constituting the first fiber part () and the second fiber part () are oriented in a direction from the first member () toward the second member ().

Bonded structure

The purpose of the present invention is to provide a bonded structure, a method for manufacturing the same, and a bonding state detection method which are capable of determining whether or not members are bonded together appropriately. A bonded structureincludes a laminated sheetA, a laminated sheetB, an adhesivethat bonds the laminated sheetA and the laminated sheetB together, and a distributed optical fibersandwiched between the laminated sheetA and the laminated sheetB. The cross-sectional shape of the distributed optical fiberis deformed in accordance with the bonding state.

Bonded structure, method for manufacturing the same, and bonding state detection method

A bonded structure includes a first member, a second member, an adhesive that bonds the first member and the second member together, and an optical fiber sandwiched between the first member and the second member. When pressure is applied to the optical fiber only from a predetermined direction, the sectional shape of the optical fiber changes to an elliptical shape, so that birefringence occurs, whereby the shape of the light spectrum changes so as to have multiple peaks. The optical fiber is used as a sensor for detecting the bonding condition between the first member and the second member based on the birefringence.

Bonded structure and bonding-condition detecting method

A method of repairing an embedded optical fiber of a composite material structure including an embedded optical fiber embedded in a composite material, includes removing a portion of the composite material including a damaged portion of the embedded optical fiber to form an opening portion; polishing an end surface of the embedded optical fiber exposed in the opening portion and an end surface of the composite material exposed in the opening portion; and performing position adjustment such that a core of the polished embedded optical fiber and a core of a replacement optical fiber are aligned with each other, butting the end surface of the embedded optical fiber and an end surface of the replacement optical fiber with each other, and connecting the end surface of the embedded optical fiber and the end surface of the replacement optical fiber together.

Repairing method, repairing structure and connecting structure of embedded optical fiber of composite material structure

Growing community of inventors

Tokyo, Japan

Shu Minakuchi