Taiwan Semiconductor Manufacturing Comp. Ltd.

Shu-Ju Tsai

Chia-Shiung Tsai

Yeur-Luen Tu

Cheng-Ta Wu

Xiaomeng Chen

Cheng-Yuan Tsai

Chen-Fa Lu

A method includes holding bonded wafers by a wafer holding module. A gap between the bonded wafers along an edge is filled with a protection material.

Method and apparatus to protect a wafer edge

Some embodiments of the present disclosure relate to an optical sensor. The optical sensor includes a first electrode disposed over a semiconductor substrate. A photoelectrical conversion element, which includes a p-type layer and an n-type layer, is arranged over the first electrode to convert one or more photons having wavelength falling within a predetermined wavelength range into an electrical signal. A second electrode is disposed over the photoelectrical conversion element. The second electrode is transparent in the predetermined wavelength range. A color filter element, which is made up of plasmonic nanostructures, is disposed over the second electrode.

Plasmonic nanostructures for organic image sensors

Growing community of inventors

Tainan, Taiwan

Shu-Ju Tsai