Asm Technology Singapore Pte Ltd

Shu Chuen Ho

Teng Hock Kuah

See Yap Ong

Si Liang Lu

Jian Wu

Jie Liu

Man Ho Hui

Kai Wu

Kar Weng Yan

Ji Yuan Hao

Charles Joseph Vath, Iii

Teng Hock Eric Kuah

Choon Hong Cheong

Srikanth Narasimulau

Chin Guan Ong

Chee Toh Teh

Swee Kwong Mok

Yan Zhou

Srikanth Narasimalu

Murali Sarangapani

Sathish Kumar Balakrishnan

Yi Yu Lin

Jiapei Ding

Ravindra Raghavendra

Ee Ling Chiw

Xiang Chen

Juay Sim Koh

Jian Xiong Su

Loon Aik Lim

Zhen Huang

Chun Yu Li

Zheng Yu Gao

Yew Lan Ngo

Zhi P Zhang

Saravana Ranganathan Damodaran

Shuai G Lee

Kock Hien Eugene Wee

Kock Hien Wee

Keng Hock Chew

Tong Heng Cheah

Eng Cheng Chng

Fu Sun Huang

Chin Chong Lee

Ning Ying

Kai Fat Yip

Lap Yu Jessie Chan

A molding system for encapsulating electronic devices mounted on a substrate, the molding system comprising a first mold chase with a first mold chase surface and a second mold chase with a second mold chase surface opposite to the first mold chase surface, the first and second mold chase surfaces being operative to clamp onto the substrate and to apply a clamping pressure thereto. The molding system further comprises a first sensor located at a first position for determining a first relative distance between the substrate and a mold chase facing the substrate at the first position, and a second sensor located at a second position for determining a second relative distance between the substrate and a mold chase facing the substrate at the second position. The molding system also comprises a first actuator located adjacent to the first position and a second actuator located adjacent to the second position, wherein the first and second actuators are operative to adjust the first relative distance with respect to the second relative distance for applying a uniform clamping pressure onto the substrate.

Molding system for applying a uniform clamping pressure onto a substrate

A semiconductor encapsulation apparatus for encapsulating a semiconductor device on a substrate, the apparatus comprising a mold comprising a cavity pressure zone that is configured to be at a molding process pressure during molding, a base vacuum pump conduit connecting a base vacuum pump to the cavity pressure zone, a base vacuum valve located along the base vacuum pump conduit such that the base vacuum pump is in fluid communication with the cavity pressure zone when the base vacuum valve is open, a reservoir vacuum pump conduit connecting a reservoir vacuum pump to the base vacuum pump conduit, and a reservoir vacuum valve located along the reservoir vacuum pump conduit such that the reservoir vacuum pump is in fluid communication with the base vacuum pump conduit when the reservoir vacuum valve is open. The base vacuum pump and the reservoir vacuum pump are each operative to reduce a pressure of the cavity pressure zone to the molding process pressure when they are in fluid communication with the cavity pressure zone.

Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump

An apparatus is disclosed for electroplating an inside wall of a transfer mold, the transfer mold being suitable for use in semiconductor device encapsulation. Specifically, the apparatus comprises a fixture, as well as a through-hole in the fixture for receiving an electrode to electroplate the inside wall of the transfer mold. In particular, the through-hole is configured to receive the electrode in a slide-fit to form a mutual interference fit for securing the electrode to the fixture. Upon fitting the electrode into the through-hole, the apparatus can then be used to electroplate the inside wall of the transfer mold by introducing the electrode into the space adjacent to the inside wall of the transfer mold. A device for use as an electrode in the apparatus is also disclosed.

Apparatus for electroplating a tooling for use in semiconductor device encapsulation

Disclosed is a platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising: a first mold chase having a first mold chase surface; the platen being operable to cooperate with a further platen having a second mold chase with a second mold chase surface to clamp a substrate, which is held against a substrate-facing surface relating to either the first or second mold chase surface, between the first and second mold chase surfaces to define at least one mold cavity with respect to the substrate; wherein the platen further comprises a rotational mounting device on which either the first or second mold chase is rotatable about at least one axis passing through the center of the substrate-facing surface to adjust the relative arrangement of the first and second mold chase surfaces. Also disclosed is a molding press comprising the platen, and the further platen cooperating with the platen.

Molding press and a platen for a molding press

A substrate having a plurality of protrusion members on its surface is molded by a molding system comprising first and second molds cooperating to apply a clamping force onto the substrate for molding, and a middle plate located between the first and second molds such that the substrate is clamped between the middle plate and the first mold during molding. A plurality of molding cavities is located on the second mold and through-holes formed in the middle plate correspond to positions of the molding cavities, such that each through-hole is sized and configured for inserting a protrusion member of the substrate to enable each protrusion member to be in communication with a molding cavity of the second mold. Molding compound is molded onto the protrusion members by the molding cavities during molding.

Optical device molding system

A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.

Apparatus for molding electronic components

A modular molding assembly comprises an input module for loading electronic devices for molding, a press station including one or more molding presses for molding the electronic devices, an output module for offloading molded electronic devices after they have been molded and a carrier that is movable at least between the input module and the press station and/or the press station and the output module. The carrier has an adaptor located thereon for detachably mounting a first attachment or a second attachment which is operative to perform a function of transporting the electronic devices and/or introducing a molding compound to the press station for conducting molding. The first and second attachments each has a corresponding mounting device for detachably mounting the first or second attachment onto the adapter and the first attachment has a different function from the second attachment.

Modular molding assembly for electronic devices

A runner system for a molding apparatus comprises a plurality of runner networks, each runner network further comprising a mold supply pot having a first side and a second side opposite to the first side. A plurality of molding cavities are located on the first and second sides of the mold supply pot, and a plurality of runners are operative to channel molding compound from each mold supply pot to the plurality of molding cavities. At least one of the mold supply pots comprises a different number of runners located on the first side which are connected to the mold supply pot as compared to a number of runners located on the second side which are connected to the mold supply pot.

Runner system for supplying molding compound

An apparatus and process are provided for molding electronic devices in a mold, which apparatus comprises at least one runner in the mold connected to a mold supply pot for channeling a molding compound from the mold supply pot to the electronic devices. A plunger assembly is also provided that comprises a main body, and a supplementary body configured to be movable relative to the main body. The plunger assembly is locatable in the mold supply pot and is drivable in a direction towards the runner for forcing the molding compound into the runner. In order to avoid or reduce cull formation, a width of the runner at an opening connecting the runner to the mold supply pot is smaller than a width of the main body of the plunger assembly.

Method and apparatus for molding with reduced cull formation

A molding apparatus comprises first and second mold chases that are configured to clamp an electronic device therebetween, and a driving mechanism which drives the first and second mold chases to apply a clamping force onto the electronic device. A pressure adjustment mechanism communicates with at least one of the mold chases and applies an additional clamping pressure onto one or more portions of the mold chase. The pressure adjustment mechanism comprises movable supports that are displaceable in directions which are substantially perpendicular to the direction of the clamping force so as to transmit and apply the said additional clamping pressure onto the mold chase, and also a plurality of piezoelectric actuators which are operative to apply displacement forces to the movable supports in their displacement directions.

Molding apparatus incorporating pressure uniformity adjustment

A method and system for molding an electronic device which is located next to a molding cavity and clamped to the molding cavity during molding, comprising providing molding compound in a mold supply pot, discharging the molding compound from the mold supply pot into a runner, and distributing the molding compound through the runner into the molding cavity in order to fill the molding cavity. A movable surface comprised in the molding cavity is positioned to form a first gap between the movable surface and the electronic device when the molding cavity is being filled. After filling the molding cavity with molding compound, the movable surface is driven to form a second gap between the movable surface and the electronic device which is smaller than the first gap, thereby compressing the molding compound in the molding cavity. A molded electronic device thus produced is then separated from the molding cavity.

Transfer molding method and system for electronic devices

A molding apparatus is provided for molding a leadframe, the molding apparatus comprising a mold having a leadframe-receiving area on its surface that is configured to receive and clamp the leadframe in the leadframe-receiving area. At least one molding cavity and a plurality of vacuum suction holes formed adjacent to the molding cavity are located within the leadframe-receiving area. The vacuum suction holes are operative to evacuate air from the mold surface, especially the molding cavity, through air vents connecting the vacuum suction holes to the molding cavity.

Vacuum molding apparatus

A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface of a semiconductor device located in the mold. A compliant tape is positionable onto the mold half comprising the sealing mechanism between the semiconductor device and the sealing mechanism for molding of the semiconductor device.

Method and apparatus for molding a semiconductor device

The invention provides a molding system for encapsulating a piece of substrate having a plurality of molding sections. The system comprises a molding device operative to separately encapsulate each molding section with a molding compound and indexing means operative to position said molding sections of the substrate relative to the molding device for encapsulation.

Sectional molding system

The invention provides an apparatus and method for reducing warpage of a substrate undergoing a molding process, comprising a conveying device for transporting the substrate during molding and pressure means adapted to act on the substrate whereby to maintain the flatness of the substrate. Using the invention, it is possible to provide an apparatus and method which are usable with conventional substrates and which reduce reliance on material formulation to maintain flatness of the substrate.

Apparatus and method for reducing substrate warpage

Growing community of inventors

Singapore, Singapore

Shu Chuen Ho