Industrial Technology Research Institute

Matsushita Electric Works, Ltd.

Food Industry Research and Development Institute

Shu-Chen Huang

Kai-Chi Chen

Hsun-Tien Li

Wen-Bin Chen

Tzong-Ming Lee

Chih-Hao Lin

Taro Fukui

Tomoaki Nemoto

Ying-Nan Chan

Yu-Lin Chao

Hing-Yuen Chan

Jeng-Yeong Tyan

Chiao-Ming Liao

Chiou-Chu Lai

Shiaw-Min Hwang

Chia-Wen Hsu

Kun-Tang Teng

Ku-Yin Ka

Pei-Jou Liu

Chich-Haw Lin

Shin-Tang Jian

Chi-Chuan Chen

Li-Chuan Liao

Yeu-Shih Yen

Ju-Pei Chen

A packaging material is provided. The packaging material includes (a) epoxy silsesquioxane, (b) epoxy resin, and (c) siloxane-imide-containing benzoxazine compound. (a) Epoxy silsesquioxane and (b) epoxy resin have a weight ratio of 0.3:1 to 10:1. The total weight of (a) epoxy silsesquioxane and (b) epoxy resin and the weight of (c) siloxane-imide-containing benzoxazine compound have a ratio of 100:20 to 100:150.

Packaging material and film

The present invention relates to a method for fermenting fish skin by using. Also provided is a use of the fermentation liquid obtained by fermenting fish skin withobtained from the method in inhibiting the activity of tyrosinase, inhibiting the activity of angiotensin-converting enzyme and/or improving the survival of fibroblasts.

[object Object]

An optical solid state prepolymer is provided, which includes a product formed by reacting 100 parts by weight of (a) epoxy resin and 0.1 to 30 parts by weight of (b) oligomeric silsesquioxane. The (a) epoxy resin includes (a1) linear siloxane epoxy resin and (a2) cyclic siloxane epoxy resin with a weight ratio of 1:1 to 5:1.

Optical solid state prepolymer and molding composition

An organic-inorganic hybrid resin, a molding composition, and a photoelectric device employing the same are disclosed. The organic-inorganic hybrid resin is a reaction product of a composition, wherein the composition includes: 0.1-10 parts by weight of reactant (a), and 100 parts by weight of reactant (b). In particular, the reactant (a) is a silsesquioxane prepolymer with metal oxide clusters, and the metal oxide cluster includes Ti, Zr, Zn, or a combination thereof. The reactant (b) includes an epoxy resin.

Organic-inorganic hybrid resin, molding composition, and photoelectric device employing the same

A siloxane resin and photoelectric device employing the same are provided. The siloxane resin composition includes (a) 45-87 parts by weight of a first siloxane compound represented by Formula (I), wherein each Ris independently Calkyl group, and n is an integer from 2 to 15;   

Siloxane resin composition, and photoelectric device employing the same

The invention provides a method for forming a fermented composition of mung bean hulls, including: mixing mung bean hulls and water to form a mixture; adding a fungus into the mixture, wherein the fungus includesspp. orspp.; and fermenting the mixture to form a fermented composition. The invention also includes a fermented composition of mung bean hulls by the method and an anti-oxidation and anti-inflammation composition containing the fermented composition of mung bean hulls.

Fermented composition of mung bean hulls, method for forming thereof, and anti-oxidation and anti-inflammation composition using the same

In one embodiment, an organic-inorganic metal oxide hybrid resin having the following formula: 

Organic-inorganic metal oxide hybrid resin, a method for forming the same, and transparent resin composition formed therefrom

A connecting structure of a flat fuel cell assembly. The assembly includes a plurality of fuel cells, each of which has a membrane electrode assembly with an anode, a proton exchange membrane and a cathode combined. Two conductive nets are attached to the surfaces of the anode and the cathode of each membrane electrode assembly by thermosetting adhesive and heat pressing to collect and transmit electrons.

Flat fuel cell assembly and fabrication thereof

A transparent silicone epoxy composition is provided. The transparent silicone epoxy composition comprises (a) at least an epoxy modified siloxane, (b) at least a silanol-containing siloxane and (c) a catalyst. Each epoxy modified siloxane molecule comprises at least two cycloaliphatic epoxy groups and epoxy modified siloxane in the transparent silicone epoxy composition is about 10&#x2dc;89 weight percentage. Silanol-containing siloxane can be cross-linked with epoxy modified siloxane. Silanol-containing siloxane comprises at least two hydroxyl groups. Silanol-containing siloxane in the transparent silicone epoxy composition is about 89&#x2dc;10 weight percentage. The catalyst in the transparent silicone epoxy composition is about 0.01&#x2dc;1 weight percentage.

Transparent silicone epoxy composition

A chip package structure and a process for fabricating the same is disclosed. The chip package structure mainly comprises a carrier, a chip and an encapsulating material layer. To fabricate the chip package, a carrier and a plurality of chips are provided. Each chip has at least an active surface with a plurality of bumps thereon. The chips and the carrier are electrically connected. An encapsulating material layer that fills the bonding gap between the chips and the carriers and covers the chips and carrier is formed. The encapsulating material layer between the chips and the carrier has a first thickness and the encapsulating material layer over the chips has a second thickness. The second thickness has a value between half to twice the first thickness.

Chip package structure and process for fabricating the same

A chip package structure is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. At least one of the chips is flip-chip bonded and electrically connected to the carrier or another chip. There is a flip-chip bonding gap between the chip and the carrier or other chips. A heat sink is positioned on the uppermost chip. The encapsulating material layer fills the flip-chip bonding gap as well as a gap between the uppermost chip and the heat sink. A part of the surface of the heat sink away from the upper-most chip is exposed. Furthermore, the encapsulating material layer is formed in a simultaneous molding process. For example, the chip is separated from the heat sink by a distance between 0.03&#x2dc;0.2 mm, and the encapsulating material has a thermal conductivity greater than 1.2 W/m.K.

Chip package structure

A chip package structure is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. At least one of the chips is bonded and electrically connected to the carrier or another chip using a flip-chip bonding technique. A flip-chip bonding gap is set up between the chip and he carrier or other chips. The heat sink is set up over the top chip. The heat sink has an area bigger than the chip. The encapsulating material layer fills up the flip-chip bonding gap and covers the carrier as well as the heat sink. The encapsulating material layer is formed in a simultaneous molding process and has a thermal conductivity more than 1.2 W/m.K. Furthermore, a plurality of standoff components may be selectively positioned on the heat sink.

Fine conductive particles are composed of metallic conductive powder, and an insulating organic capping layer on the grains of the powder. The metallic conductive powder have grains with a diameter ranging from 1 to 20 microns, and the capping layer has a thickness of 50-400 nm, which is able to flow by thermo-pressing. The insulating organic capping layer is prepared from a silane having a reactive functionality, a fluorine-containing silane and a compound or a resin having a functionality able to reactive with the reactive functionality.

Fine conductive particles for making anisotropic conductive adhesive composition

This invention is discloses a packaged integrated circuit (IC) which includes an IC chip supported and securely attached to an adapter board. The package also includes a chip cap for covering and protecting the IC chip therein. The chip cap further forms a concave, step near a lower edge of the cap for wrapping around the edge of the adapter board for increasing the contact areas between the cap and the board and for securely attaching the cap to the board. The chip cap is composed of thermal conductive materials and the chip cap further includes a heat sink for dissipating heat generated from the IC chip. The adapter board further includes a plurality of connecting vias and a plurality of conductive metal balls forming a ball grid array (BGA) underneath the adapter board. The IC chip is in electrical and thermal contact with the BGA by filling the connection vias with conductive materials. A printed circuit board (PCB) is used for supporting and receiving the adapter board thereon, the PCB includes a plurality of thermal vias penetrating therethrough and filled with thermal conductive materials, wherein the thermal vias corresponding to and in contact with a plurality of the conductive metal balls of the BGA for dissipating heat generated from the IC.

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Keelung, Taiwan

Shu-Chen Huang