Micron Technology Incorporated

Shruthi Kumara Vadivel

Deepti Verma

Fatma Arzum Simsek-Ege

Trupti D Gawai

Lavanya Sriram

Anshika Sharma

Harsh Narendrakumar Jain

Lifang Xu

Justin B Dorhout

Tomoko Ogura Iwasaki

Shuangqiang Luo

Matthew J King

Scott L Light

David A Kewley

Adam L Olson

Yi Hu

Matthew Park

Xiaosong Zhang

Jason Reece

Biow Hiem Ong

Michael J Gossman

Martin Jared Barclay

Joel D Peterson

Bo Zhao

Sue-Fern Ng

Tien Minh Quan Tran

Kari Crane

Kah Sing Chooi

Zhen Feng Yow

A microelectronic device includes a stack structure including a vertically alternating sequence of conductive structures and insulating structures arranged in tiers, a dielectric-filled opening vertically extending into the stack structure and defined between two internal sidewalls of the stack structure, a stadium structure within the stack structure and comprising steps defined by horizontal ends of at least some of the tiers, a first ledge extending upward from a first uppermost step of the steps of the stadium structure and interfacing with a first internal sidewall of the two internal sidewalls of the stack structure, and a second ledge extending upward from a second, opposite uppermost step of the steps of the stadium structure and interfacing with a second, opposite internal sidewall of the two internal sidewalls.

Microelectronic devices including stadium structures

Microelectronic devices include a tiered stack including a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. A stadium within the tiered stack includes a staircase with steps at ends of some of the tiers. The steps each have a tread provided by an upper surface portion of one of the conductive structures. Conductive contact structures extend to one of the steps and include a first conductive contact structure terminating at the tread of the step and a second conductive contact structure extending through the tread of the step. Related fabrication methods and electronic systems are also disclosed.

Microelectronic devices with staircased stadiums and both through-step and to-step contacts, and related systems and methods

Methods, devices, and systems related to process control in manufacturing are described. In an example, a method can include receiving data from a first process control device affixed to a first manufacturing tool of a first type, identifying one or more attributes of the data via a second processing resource of a second process control device affixed to a second manufacturing tool of a second type different from the first type, determining one or more settings for the second manufacturing tool via the second processing resource in response to identifying the one or more attributes of the data, and sending a command including the one or more settings to the second manufacturing tool from the second process control device.

Process control device in manufacturing

Methods and non-transitory machine-readable media associated with treatment plan identification are described. Treatment plan identification can include receiving first signaling configured to monitor user health data and receiving second signaling configured to monitor user behavior data. Treatment plan identification can include writing data that is based at least in part on a combination of the first signaling and the second signaling and identifying output data representative of a treatment plan for the user based at least in part on input data representative of the written data and additional user data. Output data representative of the treatment plan can be transmitted to a computing device accessible by the user, a computing device accessible by a provider, or both.

Treatment plan identification

Methods and devices related to a cellular signal mesh network are described. In an example, a method can include determining, via a processing resource of a first computing device, whether a cellular signal of the first computing device is below a threshold cellular signal, transmitting from the first computing device to a second computing device first signaling including data representing a request for operational data of the second computing device in response to determining that the cellular signal of the first computing device is below the threshold cellular signal, receiving from the second computing device second signaling comprising the operational data of the second computing device, and transmitting from the first computing device to the second computing device third signaling including data representing at least one of: a voice call, a video call, or a message in response to receiving the second signaling comprising the operational data.

Cellular signal mesh network

Methods, systems, and devices for operating emergency prevention sensor systems are described. Devices can include a plurality of components including a sensor component, a processor, and memory. In an example, a method can include receiving at a processor signaling from a plurality of environmental sensing devices, each having at least one biodegradable component, in an area of concern, wherein the area of concern corresponds to a particular set of coordinates in a database, determining environmental characteristics of an emergency associated with the area of concern based, at least in part, on the signaling, and determining a preventive action based on the determined characteristics. In another example, a number of components of the sensing devices are biodegradable.

Operating emergency prevention sensor systems

A microelectronic device comprises a stack structure comprising a vertically alternating sequence of conductive structures and insulative structures arranged in tiers. The stack structure comprises a first block structure comprising stair step structures spaced from each other by crest regions, the stair step structures each comprising steps defined at horizontal edges of the tiers of the conductive structures and the insulative structures, and a second block structure horizontally neighboring the first block structure and comprising additional stair step structures spaced from one another by additional crest regions, the additional stair step structures horizontally offset from the stair step structures of the first block structure, and a slot structure extending though the stack structure and interposed between the first block structure and the second block structure. Related microelectronic devices, electronic systems, and methods are also described.

Microelectronic device structures including tiered stacks comprising staggered block structures separated by slot structures, and related electronic systems and methods

Growing community of inventors

Boise, ID, United States of America

Shruthi Kumara Vadivel