International Business Machines Corporation

Shriya Kumar

John Ulrich Knickerbocker

Jae-Woong Nah

Minhua Lu

Kang-Wook Lee

A health & fitness tracking device may include a display that provides fitness information to a wearer of the health & fitness tracking device, at least one physiological sensor that obtains physiological data by monitoring at least one physiological condition of the wearer, at least one environmental sensor that obtains environmental data by monitoring at least one environmental condition, a data storage device that stores the physiological data, the environmental data, and medical history data relating to the wearer, a memory storing a computer program, and a processor that executes the computer program. The computer program may adjust a sensor configuration of the at least one physiological sensor based on the medical history data.

Health and fitness tracking

Systems and methods for monitoring body mounted/implanted sensors in combination with environmental sensors and sensors attached to person's medical/sports equipment. Data indicating a plurality of measured quantities associated with movement of a person at a time point is received. Each measured quantity within the plurality of measured quantities having been determined by a respective sensor attached to a respective location on the person or the person's environment or the person's medical/sports equipment. At least one characteristic of the person associated with the time point is determined based on analyzing the plurality of measured quantities. The at least one characteristic is stored. Recommendations for the person are determined based upon the characteristics, and a report comprising the recommendations is provided.

Wearable sensor monitoring and data analysis

A method includes forming one or more vias in a substrate, forming a first photoresist layer on a top surface of the substrate and a second photoresist layer on a bottom surface of the substrate, patterning the first photoresist layer and the second photoresist layer to remove at least a first portion of the first photoresist layer and at least a second portion of the second photoresist layer, filling the one or more vias, the first portion and the second portion with solder material using injection molded soldering, and removing remaining portions of the first photoresist layer and the second photoresist layer.

Via and trench filling using injection molded soldering

A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.

A method includes forming one or more vias in a substrate, forming at least one liner on at least one sidewall of at least one of the vias, and filling said at least one via with solder material using injection molded soldering. The at least one liner may comprise a solder adhesion layer, a barrier layer, or a combination of a barrier layer and a solder adhesion layer.

A method includes forming one or more trenches in a first substrate, forming one or more vias in a second substrate, aligning at least a first trench in the first substrate with at least a first via in the second substrate, and sealing the first substrate to the second substrate by filling the first via and the first trench with solder material using injection molded soldering.

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New York, NY, United States of America

Shriya Kumar