Marvell Asia Pte., Ltd.

Shrinath Ramdas

Roberto Coccioli

Dwayne Richard Shirley

Han Gao

Ershad Ali

A semiconductor device package includes a semiconductor die having two largest dimensions that define a major plane, a packaging material enclosing the semiconductor die, a plurality of contacts on a first exterior surface of the semiconductor device package that is parallel to the major plane, the first exterior surface defining a bottom of the semiconductor device package, and a pedestal of semiconductor material above the semiconductor die in a thermally-conductive, electrically non-conductive relationship with the semiconductor die. The semiconductor material of the pedestal may be doped to provide electromagnetic shielding of the semiconductor die.

Growing community of inventors

Agoura Hills, CA, United States of America

Shrinath Ramdas