Marvell Asia Pte., Ltd.

Shrinath Ramdas

Roberto Coccioli

Jing Li

Dwayne Richard Shirley

Hassan Kobeissi

Poorna Chander Ravva

Shaohui Yong

Embodiments relate to a die package featuring a sputtered metal shield to reduce Electro-Magnetic Interference (EMI). According to a particular embodiment, a die featuring a top surface exposed by surrounding Molded Underfill (MUF) material, is subjected to metal sputtering. The resulting sputtered metal shield is in direct physical and thermal contact with the die, and is in electrical contact with a substrate supporting the die (e.g., to provide shield grounding). Specific embodiments may be particularly suited to reducing the EMI of a package containing an electro-optic die, to between 3-15 dB. The conformal nature and small thickness of the sputtered metal shield desirably conserves space and reduces package footprint. Direct physical contact between the shield and the die surface exposed by the MUF, enhances thermal communication (e.g., reducing junction temperature). According to certain embodiments, the sputtered metal shield comprises a stainless steel liner, copper, and a stainless steel coating.

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San Jose, CA, United States of America

Shrinath Ramdas