Shell Oil Comapny

Shridhar R Iyer

Pui Kwan Wong

C David Shirrell

A novel thermally reworkable die attach adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises

Die attach adhesive compositions

A novel thermally reworkable anisotropic conductive adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises

Anisotropic conductive adhesive compositions

A semiconductor device is attached to a supporting substrate by a plurality of solder connections that extend from the supporting substrate to the semiconductor device and the gap between the supporting substrate and the semiconductor device is filled with a reworkable composition comprising:

Thermally reworkable binders for flip-chip devices

An electronic package is provided where in a semiconductor device on a substrate is encapsulated with a thermally reworkable encapsulant composition including: (a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one filler present from about 25 to about 75 percent by weight based upon the amount of components (a) and (b). Such a process provides a readily reworkable electronic package.

Thermosetting Encapsulants for electronics packaging

A process is described for minimizing resin waste in the impregnation of a fibrous substrate with a thermosettable resin. The process involves the use of resin application means comprising a rotatable roller on which is deposited a liquid-form thermosettable resin; passing a fibrous substrate in countercurrent contact with the thermosettable resin on the rotating roller so as to transfer the thermosettable resin to the fibrous substrate; removing any untransferred resin from the rotating roller and depositing the removed resin onto the fibrous substrate prior to contact thereof with the rotating roller; and passing the resin-containing fibrous web to a heating zone to partially cure the resin. The process is particularly suited for application of a solventless resin formulation to a glass web in the preparation of a prepreg for an electrical laminate.

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Sugar Land, TX, United States of America

Shridhar R Iyer