University of Texas System

Molecular Imprints, Inc.

Shrawan Singhal

Sidlgata V Sreenivasan

Ovadia Abed

Lawrence R Dunn

Paras Ajay

Mark McDermott

Aseem Sayal

Michael Cullinan

Vipul Goyal

Lawrence A Dunn

S V Sreenivasan

Jaydeep Kulkarni

Brian Gawlik

Byung-Jin Choi

Anshuman Cherala

Byung Jin Choi

Ian Matthew McMackin

Akhila Mallavarapu

Roger Bonnecaze

Ofodike A Ezekoye

Brent Andrew Snyder

Meghali Chopra

Bailey Yin

Miaomiao Yang

David Choi

Parth Pandya

SV Sreenivasan

Various embodiments of the present technology generally relate to substrate planarization. More specifically, some embodiments of the present technology relate a versatile systems and methods for precision surface topography optimization known as planarization on nominally planar substrates. In some embodiments, a method for planarization of a patterned substrate using inkjets can determine the global and nanoscale topography and pattern information of the patterned substrate. Based upon the global and nanoscale topography and pattern information, a drop pattern can be determined and then dispensed on the patterned substrate. A gap between the patterned substrate and a superstrate causing the dispensed drops can be closed to form a substantially contiguous film. The substantially contiguous film can be cured and the superstrate can be separated from the patterned substrate with substantially contiguous film on the patterned substrate.

System and method for modification of substrates

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place

A method and system for nanoscale precision programmable profiling on substrates. Profiling material is dispensed on a substrate or a superstrate. The superstrate is brought in contact with the substrate. The profiling material is then cured after bringing the superstrate in contact with the substrate. The superstrate is separated from the substrate after curing. An optical metrology of points on the substrate corresponding to the final substrate profile is then performed.

Nanoscale thin film deposition systems

A method for fabricating a three-dimensional (3D) stacked integrated circuit. Pick-and-place strategies are used to stack the source wafers with device layers fabricated using standard two-dimensional (2D) semiconductor fabrication technologies. The source wafers may be stacked in either a sequential or parallel fashion. The stacking may be in a face-to-face, face-to-back, back-to-face or back-to-back fashion. The source wafers that are stacked in a face-to-back, back-to-face or back-to-back fashion may be connected using Through Silicon Vias (TSVs). Alternatively, source wafers that are stacked in a face-to-face fashion may be connected using Inter Layer Vias (ILVs).

Nanoscale-aligned three-dimensional stacked integrated circuit

A method for fabricating patterns. An inverse optimization scheme is implemented to determine process parameters used to obtain a desired film thickness of a liquid resist formulation, where the liquid resist formulation includes a solvent and one or more non-solvent components. A substrate is covered with a substantially continuous film of the liquid resist formulation using one or more of the following techniques: dispensing discrete drops of a diluted monomer on the substrate using an inkjet and allowing the dispensed drops to spontaneously spread and merge, slot die coating and spin-coating. The liquid resist formulation is diluted in the solvent. The solvent is then substantially evaporated from the liquid resist formulation forming a film. A gap between a template and the substrate is then closed. The film is cured to polymerize the film and the substrate is separated from the template leaving the polymerized film on the substrate.

Wafer-scale programmable films for semiconductor planarization and for imprint lithography

A method for fabricating patterns on a flexible substrate in a roll-to-roll configuration. Drops of a monomer diluted in a solvent are dispensed on a substrate, where the drops spontaneously spread and merge with one another to form a liquid resist formulation. The solvent is evaporated (e.g., blanket evaporation) from the liquid resist formulation followed by selective multi-component resist film evaporation resulting in a non-uniform and substantially continuous film on the substrate. The gap between the film on the substrate and a template is closed such that the film fills the features of the template. After cross-linking the film to polymerize the film, the template is separated from the substrate thereby leaving the polymerized film on the substrate.

Roll-to-roll programmable film imprint lithography

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise more alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Heterogeneous integration of components onto compact devices using moire based metrology and vacuum based pick-and-place

The present disclosure regards a large area functional metrology system for inspecting nanophotonic devices. The large area functional metrology system can include one or more light sources, optical components such as lenses and polarizers, and one or more camera sensors. The light source can irradiate light onto a nanophotonic device while the optical components can guide the light through the system and modulate states of the light. The camera sensor can record images of the nanophotonic device interacting with the irradiated light. The images can be taken as a function of one or more states. The system can also include a detector which can processes the images in order to detect defects. The defects can then be classified using one or more defect signatures. Based on this classification, the root causes of the defects can be automatically identified.

High throughput, high resolution optical metrology for reflective and transmissive nanophotonic devices

A method and alignment system for minimizing errors in the deposition of films of tailored thickness. A first position on a stage is identified for optimal placement of a downward looking microscope (DLM) and an upward looking microscope (ULM) when alignment marks on the DLM and ULM are aligned, where the DLM is attached to a bridge and the ULM is attached to the stage. A second position on the stage is identified when the ULM on the stage is aligned with the alignment marks on a metrology tool. A surface of a chucked substrate affixed to the stage is then measured. A map between a substrate coordinate system and a metrology coordinate system may then be obtained using the measured surface of the chucked substrate with the first and second positions.

Precision alignment of the substrate coordinate system relative to the inkjet coordinate system

Systems and methods for precision inkjet printing are disclosed. A method determining an actuation parameter associated with a pressure waveform. Based on the pressure waveform, the method also includes actuating a print head to eject a droplet from a nozzle and acquiring an image of the droplet. The method further includes processing the acquired image to estimate a volume of the droplet and based on the estimated volume of the droplet and a target volume, adjusting the actuation parameter.

Systems and methods for precision inkjet printing

A method for template fabrication of ultra-precise nanoscale shapes. Structures with a smooth shape (e.g., circular cross-section pillars) are formed on a substrate using electron beam lithography. The structures are subject to an atomic layer deposition of a dielectric interleaved with a deposition of a conductive film leading to nanoscale sharp shapes with features that exceed electron beam resolution capability of sub-10 nm resolution. A resist imprint of the nanoscale sharp shapes is performed using J-FIL. The nanoscale sharp shapes are etched into underlying functional films on the substrate forming a nansohaped template with nanoscale sharp shapes that include sharp corners and/or ultra-small gaps. In this manner, sharp shapes can be retained at the nanoscale level. Furthermore, in this manner, imprint based shape control for novel shapes beyond elementary nanoscale structures, such as dots and lines, can occur at the nanoscale level.

Nanoshape patterning techniques that allow high-speed and low-cost fabrication of nanoshape structures

A method for depositing thin films using a nominally curved substrate. Drops of a pre-cursor liquid organic material are dispensed at a plurality of locations on a nominally curved substrate by one or more inkjets. A superstrate is brought down on the dispensed drops to close the gap between the superstrate and the substrate thereby allowing the drops to form a contiguous film captured between the substrate and the superstrate. A non-equilibrium transient state of the superstrate, the contiguous film and the substrate is enabled to occur after a duration of time. The contiguous film is then cured to solidify it into a solid. The solid is separated from the superstrate thereby leaving a polymer film on the substrate. In this manner, such a technique for film deposition has the film thickness range, resolution and variation required to be applicable for a broad spectrum of applications.

Versatile process for precision nanoscale manufacturing

An inkjet-based process for programmable deposition of thin films of a user-defined profile. Drops of a pre-cursor liquid organic material are dispensed at various locations on a substrate by a multi-jet. A superstrate is held in a roll-to-roll configuration such that a first contact of the drops is made by a front side of the superstrate thereby initiating a liquid front that spreads outward merging with the drops to form a contiguous film captured between the substrate and the superstrate. A non-equilibrium transient state of the superstrate, the contiguous film and the substrate then occurs after a duration of time. The contiguous film is then cured to crosslink it into a polymer. The superstrate is then separated from the polymer thereby leaving a polymer film on the substrate. In such a manner, non-uniform films can be formed without significant material wastage in an inexpensive manner.

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Austin, TX, United States of America

Shrawan Singhal