Mitsubishi Denki Kabushiki Kaisha

Shozui Takeno

Masaharu Moriyasu

Miki Kurosawa

Masanori Mizuno

Kazuo Hayashi

Masahiro Tamaki

Masahiko Sakamoto

Tsukasa Fukushima

Masayuki Kaneko

Satoshi Nishida

Masaru Kanaoka

Kazumichi Machida

Hiroshi Sasai

Koji Funaoka

Yasuhiko Iwai

Seiji Yasunaga

Kohei Murakami

Takayuki Yuyama

Toshiyuki Hokodate

Homare Mori

Mari Yoshimura

In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 &#x3bc;s and with energy density of about 20 J/cmor more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.

Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board

A laser machining device according to the invention is provided with a laser oscillator for generating a laser beam, a main deflecting galvannometer mirror, an F&#x3b8; lens, and a sub-deflecting means arranged in an optical path between the laser oscillator and the main deflecting galvanometer mirror. A means for splitting a laser beam is provided, and the sub-deflecting means is inserted into the optical path of one of the split laser beams. At the same time, both the split laser beams are incident from the same main deflecting galvannometer mirror to the F&#x3b8; lens, and a numerical aperture in the optical system constituted by the main deflecting galvannometer mirror, the F&#x3b8; lens, and an object is set to be not more than 0.08.

Laser machining device

A laser inspection apparatus has a light source for outputting laser beam, application means for irradiating the laser beam output from the light source to any desired position of a detected body , first detection means for detecting fluorescence generated from the detected body to which the laser beam is applied, and second detection means for detecting reflected light scattered on a surface of the detected body to which the laser beam is applied.

Laser inspection apparatus

As a scanning device for positioning the irradiation position of the laser beam emitted from a laser oscillator at a position of arbitrary coordinates in the commanded mutually orthogonal X-axis direction and Y-axis direction, two galvanomirrors having mutually orthogonal rotary axes and a scan lens are provided, and the light generated from a printed circuit board irradiated with laser beam is detected by a detector, and approval or rejection of inspection result at each position of coordinates is judged on the basis of the output signal of the detector.

Apparatus for inspecting a printed circuit board

In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 &mgr;s and with energy density of about 20 J/cm or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.

A semiconductor wafer is prepared which includes a semiconductor layer having on its surface a plurality of functional devices, and a separation line region surrounding and separating the plurality of functional devices from one another. A metal layer is formed on the surface of separation line region of semiconductor region. A reinforcing layer is formed on the surface of semiconductor wafer. By selectively etching the back surface of semiconductor layer, a hole is formed to surround the peripheries of functional device, passing through semiconductor layer and reaching from the back surface to metal layer. Reinforcing plate is removed from semiconductor wafer. Metal layer is irradiated with laser and fused to provide a plurality of semiconductor chips separated from one another.

Semiconductor device and method of manufacturing the same

Method of dicing semiconductor wafer

A laser cutting method with which cutting faults at the time of cutting condition changing are substantially eliminated. Impingement of the laser beam on the workpiece is stopped when the laser beam reaches a position along the path where the first cutting conditions are to be changed to second cutting conditions. The laser beam is then retracted along the path a predetermined distance from the position where the first cutting conditions are to be switched to the second cutting conditions. After a delay time, the laser beam is again moved along the predetermined path to cut the workpiece under the second cutting conditions. The retraction distance is set in accordance with the thickness of the workpiece. Also, an assist gas may be sprayed on the workpiece in the vicinity of the cutting path while impingement of the beam is stopped.

Laser cutting method eliminating defects in regions where cutting

An insulated wire having a conductor coated with insulating material wherein a light absorbing layer is provided between the conductor and the insulating material, thereby an insulating coating can be easily peeled off by means of laser.

Insulated wire

A process is provided for working a base material which essentially consists of a ceramic material. The process includes an irradiation process of irradiating a laser beam or an electron beam to the base material in order to form an affected portion having cracks in the base material and a removing process for removing the affected portion. The ceramic material includes an oxide ceramic material (for example, alumina and forsterite) and a carbide ceramic material. The shape and the depth of the portion to be worked are controlled by the scanning of the laser beam or the electron beam. The removing process can include any one of the processes of vibrating the base material, applying a thermal shock to the base material and etching the base material. In accordance with the present invention, a base material which essentially consists of an oxide ceramic material or a carbide ceramic material can be worked with high aspect ratio and in a shorter period of time than in a conventional process.

Growing community of inventors

Tokyo, Japan

Shozui Takeno