Kabushiki Kaisha Toshiba

Nippon Telegraph and Telephone Corporation

Tokyo Electric Co.

Shozo Takeno

Toshio Shimizu

Koichiro Sakamoto

Takashi Saito

Satoshi Suzuki

Hisashi Nishikawa

Masayuki Kakegawa

Ikuo Fujisawa

Yoshimasa Adachi

Masanobu Hirata

A liquid crystal apparatus in which an anisotropic conductive layer made of organic resin containing several electrically conductive particles having substantially identical particle sizes is disposed between lead electrodes of a liquid crystal device and the lead electrodes of a drive circuit board, thermocompression bonding being applied to make the electrically conductive particles in direct contact with both lead electrodes to allow both lead electrodes to be electrically connected with each other. Further, at least one of the lead electrodes of a common electrode in the liquid crystal device and of the circuit board corresponding to the common electrode includes a number of separated electrodes that are spaced apart, and the pitches and widths of the separated electrodes are in the range of .+-.30% around the average values for pitch and width for the separated electrodes.

Liquid crystal apparatus having an anisotropic conductive layer between

This invention relates to a thermal head suitable for constituting a multithermal head used in a color printer, a method of manufacturing the same, and a multithermal head constituted by the thermal heads. The thermal head comprises a flexible insulating film having heating elements arranged in a predetermined pattern and lead wires which have one ends electrically connected to the elements, the film being fixed on a substrate, and heating element driver ICs mounted on the substrate and electrically connected to the wires on the film. The method comprises the steps of, coating the film on the plate, forming the elements in a predetermined pattern and the wires on the film, dividing the plate into portions in accordance with a change in level of a surface of the substrate to which the film is to be fixed, fixing the divided portions of the plate on the substrate, and locating the ICs at a position lower than that of the elements on the substrate and connecting the other ends of the wires to the ICs. In the multithermal head, the thermal heads are fixed on a base so as to make lines of the elements of one thermal head parallel to the lines of that of the other thermal heads.

Thermal head method of manufacturing

This invention relates to a thermal head suitable for constituting a multithermal head used in a color printer, a method of manufacturing the same, and a multithermal head constituted by the thermal heads. The thermal head comprises a flexible insulating film having heating elements arranged in a predetermined pattern and lead wires which have one end electrically connected to the elements, the film being fixed on a substrate, and heating element driver ICs mounted on the substrate and electrically connected to the wires on the film. The method comprises the steps of, coating the film on the plate, forming the elements in a predetermined pattern and the wires on the film, dividing the plate into portions in accordance with a change in level of a surface of the substrate to which the film is to be fixed, fixing the divided portions of the plate on the substrate, and locating the ICs at a position lower than that of the elements on the substrate and connecting the other ends of the wires to the ICs. In the multithermal head, the thermal heads are fixed on a base so as to make lines of the elements of one thermal head parallel to the lines of that of the other thermal heads.

Thermal print head

A thermal print head comprises a heat resisting resin film and resistive heating layers and metal circuit layers on the film, the metal circuit layers connected to the resistive heating layers respectively. The film is supported on a heat sink substrate provided with a flat surface and corner sections formed at the both sides of the flat surface, the resistive heating layers positioned over the flat surface. The heat sink substrate supports the film to prevent the resistive heating layers from electrical resistance value fluctuation due to bending of the film.

A strain sensor includes an insulating resin, e.g. polyimide resin, film formed on a beam body having a strain generating section and a wiring layer having a resistance material, e.g. nickel-chrome, layer formed on the polyimide resin film and a gold layer selectively formed on the nickel-chrome layer. A solid powder, e.g. silicon dioxide, is mixed with the polyimide resin film.

Strain gauge with reduced creep phenomenon by improved insulation

A load cell includes a bridge circuit having first to fourth strain gauge resistors and first and second temperature compensating resistors connected to the respective first and second strain gauge resistors. The first to fourth strain gauge resistors comprise a Nichrome layer formed on an insulating film, the first and second temperature compensating resistors each comprise a two-layered structure of the Nichrome layer and a titanium layer formed thereon, and connecting means for connecting the first to fourth strain gauge resistors and first and second temperature compensating resistors comprise a three-layered structure of the Nichrome layer and titanium layer and also a gold layer formed on the titanium layer.

Growing community of inventors

Yokohama, Japan

Shozo Takeno