Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Shozo Ochi

Daisuke Sakurai

Fumio Echigo

Yoji Ueda

Norihito Tsukahara

Hidenobu Nishikawa

Tadashi Nakamura

Hiroshi Sakurai

Tousaku Nishiyama

Yasuhiro Nakatani

Daizo Andoh

Kazuhiro Ikurumi

Takeru Tamari

Hirohisa Tanaka

Yutaka Nakamura

Shigeaki Sakatani

Keiichi Kusumoto

Osamu Uchida

Takashi Yamada

Masato Mori

Masato Maede

Ryo Ishikawa

Masato Hirano

Kiyokazu Itoi

Yoshitake Hayashi

Tomonari Nebashi

Kazuya Ushirokawa

Ken Yasue

Kazuo Ohtani

Yosuke Maeba

A cooling unit includes a unit main body including a bottom portion, a peripheral wall portion rising from the peripheral edge of the bottom portion, and a seal for sealing an opening of the unit main body. The unit main body is joined to the seal through a plasticized region, and a void is defined in the peripheral wall portion of the unit main body.

Cooling unit and method for manufacturing cooling unit

A solid-state imaging device includes a solid-state imaging element and a substrate fixed to the solid-state imaging element by a sealing resin on a surface on an opposite side of a light receiving surface of the solid-state imaging element, an outer edge of the substrate seen from the light receiving surface side of the solid-state imaging element is positioned within an outer edge of the solid-state imaging element and an outer edge of the sealing resin seen from the light receiving surface side of the solid-state imaging element is positioned within the outer edge of the solid-state imaging element. The sealing resin includes a first sealing resin and a second sealing resin not contacting the first sealing resin to seal the components.

Solid-state imaging device having electronic components mounted between a main substrate and an imaging element

A method for manufacturing a semiconductor device includes: supplying a resist to a first surface of a semiconductor element having a plurality of electrode pads to cover the electrode pad surfaces; opening the resist on the electrode pad surfaces to expose the electrode pad surfaces from the resist; curing the resist by applying light or heat to the resist; forming bump electrodes on the electrode pad surfaces by filling a plating solution into the openings of the resist; and peeling the resist from the first surface of the semiconductor element.

Method for manufacturing semiconductor device

An optical module structure includes a main substrate, an interposer substrate electrically connected to the main substrate via a first protruding electrode, a first communication LSI electrically connected to the interposer substrate via a second protruding electrode, an IC element electrically connected to the interposer substrate via a lateral-surface connection terminal of the interposer substrate and via a third protruding electrode, an Si bench substrate electrically connected to the IC element via a fourth protruding electrode and via a lateral-surface connection terminal of the Si bench substrate, an optical element electrically connected to the Si bench substrate via a fifth protruding electrode, and an optical fiber optically connected via an optical waveguide formed on the Si bench substrate.

Optical module structure

An implementing structure intermediate body including: a first chip having a first connection terminal; a second chip having a second connection terminal in a face that faces the first chip; and a film wiring substrate having a third connection terminal in one face, which is arranged between the first chip and the second chip, is loaded on a chip loading substrate having a fifth connection terminal so that another one face of the first chip is confronted thereby. In the film wiring substrate, there is a portion that is located outside any of the first chip and the second chip, at the tip part, is provided a fourth connection terminal connected to the third connection terminal by wiring, one part of the first connection terminal is connected with the second connection terminal, the third connection terminal is connected with another one part of the first connection terminal, and the fifth connection terminal is connected to the fourth connection terminal.

Electronic component implementing structure intermediate body, electronic component implementing structure body and manufacturing method of electronic component implementing structure body

A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

Component built-in module, and manufacturing method for component built-in module

The semiconductor memory module incorporating antenna includes a wiring board () having a connection terminal () connected with a control semiconductor element () and arranged at a position exposed to the surface of an outer case (), and a terminal electrode () for antenna connection connected with the control semiconductor element () and arranged in the outer case (); a semiconductor storage element () mounted on one side of the wiring board (); and a loop-like antenna () and an antenna terminal electrode () formed on the other side of the wiring board () along the outer peripheral thereof, the wiring board () includes at least one magnetic body layer () and the terminal electrode () for antenna connection is connected with the antenna terminal electrode ().

Semiconductor memory module incorporating antenna

An antenna built-in module which incorporates an antenna, is thin and excellent in antenna characteristics, a card type information device and a method for manufacturing the same are provided. A wiring board () which has a wiring pattern () and in which an electronic component is mounted on at least one surface thereof, a magnetic substance () embedded in the other surface of the wiring board (), an antenna pattern () provided on the magnetic substance (), the wiring pattern () of the wiring board () and the antenna terminal electrode of the antenna pattern () are connected by a conductive via ().

Antenna built-in module, card type information device, and methods for manufacturing them

A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element.

Storage medium with built-in antenna

Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrode formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.

Card type information device and method for manufacturing same

A semiconductor memory module formed of a mounted module () having a semiconductor memory device () and a control semiconductor device (), a circuit board () which contains connection terminal () coupled with the control semiconductor device () and disposed so that it is exposed from the surface of outer case (), and an antenna connection terminal electrode () disposed in the inside of outer case (); and an antenna module () having a sheet board () which includes an antenna () disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer () of magnetic substance disposed on the other surface, and an antenna terminal electrode () disposed on the one or the other surface. The antenna module () is overlaid on the mounted module (), and the antenna connection terminal electrode () is connected with the antenna terminal electrode ().

Semiconductor memory module having built-in antenna

The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole with a conductor, peeling mold-releasing films, compressing the dielectric substrate and forming metal foils. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity.

Method for manufacturing printed circuit board

A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor. By adjusting the thickness of the resin layers formed on both sides of the resin holder such as a glass cloth, it is possible to ensure high reliability when electrically connecting circuit boards using an electrically conductive paste as the electrical conductor.

Printed circuit board and method for producing the same

The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

Growing community of inventors

Osaka, Japan

Shozo Ochi