Fukuda Metal Foil & Powder Co., Ltd.

Toyota Jidosha Kabushiki Kaisha

Shozo Nagai

Minoru Kawasaki

Akio Sato

Katsunori Otobe

Kensuke Hidaka

Kanichi Tanaka

Noboru Takayanagi

Osamu Kajita

Isaka Kanazawa

Hiromi Nomura

Yoshinobu Yagita

The present invention relates to a Ni-base brazing alloy. The alloy has a good wettability toward a material to be brazed when melting, an excellent corrosion resistance and a high strength. The alloy is used for process of joining two pieces of metal such as stainless steel. The alloy contains Cr in an mount of 25 to 35% by weight, P in an amount of 4 to 8% by weight, Si in an amount of 3 to 6% by weight, wherein the total amount of P and Si is 9 to 11.5% by weight, at least one selected from a group consisting of Al, Ca, Y and misch metal in an amount of 0.01 to 0.10% by weight, and the balance of Ni and unavoidable impurities.

Ni-base brazing alloy

A wear-resistant copper-based alloy includes 10.0 to 30.0% by weight Ni, 2.0 to 15.0% by weight Fe, 2.0 to 15.0% by weight Co, 0.5 to 5.0% by weight Si, 1.0 to 10.0% by weight Cr, 2.0 to 15.0% by weight at least one first optional element selected from the group consisting of Mo, Ti, Zr, Nb and V, at least one second optional element selected from the group consisting of C and O, and the balance of Cu and inevitable impurities. A carbon content 'X' and an oxygen content 'Y' satisfy the following relationships; namely: 0.ltoreq.'X'.ltoreq.0.5, 0.ltoreq.'Y'.ltoreq.0.05, and 'Y'.gtoreq.(-0.8)('X')+0.04. The wear-resistant copper-based alloy enables to improve the toughness of weld bead, and to inhibit weld bead from cracking effectively in the solidifying process of a building-up operation.

Wear-resistant copper-based alloy

A tin base soldering/brazing material contains 0.05 to 1.5 wt. % of P, 0.5 to 5.0 wt. % of Ni, if necessary, 30 wt. % or less of Cu, and/or 10 wt. % or less of Ag, and the balance of Sn and unavoidable impurities, wherein the total amount of Ni, Cu and Ag is 35 wt. % or less. This tin base soldering/brazing material is used as a tin base low melting point brazing material. Further, this tin base soldering/brazing material is used as a tin base lead-free solder wire having a diameter less than 100 .mu.m and pulling strength of the wire higher than a lead-tin solder wire, and a tin base lead-free solder ball having a diameter less than 1,000 .mu.m and a hardness higher than a tin base lead-free solder ball.

Tin base soldering/brazing material

Growing community of inventors

Kyoto, Japan

Shozo Nagai