Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Shozo Minamitani

Shinji Kanayama

Kenji Takahashi

Kazushi Higashi

Satoshi Shida

Naoto Hosotani

Shunji Onobori

Yasuharu Ueno

Kenichi Nishino

Koichi Morita

Makoto Akita

Akira Kabeshita

Takashi Shimizu

Hiroshi Wada

Takaharu Mae

Shuichi Hirata

Kurayasu Hamasaki

Yoichi Makino

Noriyuki Tani

Syunji Onobori

Takafumi Tsujisawa

Akira Yamada

Makoto Morikawa

Hiroyuki Otani

Hiroyuki Naito

Nobuhisa Watanabe

Shinya Marumo

Akira Mori

Tomoaki Nakanishi

Kenji Okamoto

Shinzo Eguchi

Yasuhiro Kametani

Masakazu Yamano

Kazuya Yamamoto

Satoshi Sida

A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Component mounting apparatus

A heating and pressurizing apparatus (), to which a circuit board () with electronic components () pre-bonded thereto via bonding elements () is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member () having a heating device (). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

Component mounting method, component mounting apparatus, and ultrasonic bonding head

A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.

While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet, corresponding to an adhesion region of a semiconductor chip, is sucked and held, a plurality of protruding portions of a removing member are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the adhesion region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change an adhesive surface bond of the semiconductor chip to the adhesive sheet to point bonding. Further, the removing member is moved along the bottom surface of the semiconductor chip so as to change the position of the point bonding and decrease the adhesive bonding force to the adhesive sheet. Then, the semiconductor chip is removed from the adhesive sheet.

Apparatus and method for removing semiconductor chip

Componentis pressed onto a circuit boardso that their respective metal interconnectsare in close contact with each other, and ultrasonic vibration is applied to the suction nozzleholding the component. Friction is thereby generated between metal interconnectswhereby the componentis bonded on circuit substrate. Suction nozzlefor handling components is made of stainless steel and has a working faceprovided with a hardened layer, or alternatively, suction nozzlemay have a suction headhaving a working facemade of cemented carbide. Working faceof suction nozzleis refined by polishing as required during the mounting operation.

Component mounting tool, and method and apparatus for mounting component using this tool

A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Component mounting method

After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.

Apparatus and method for mounting electronic components

In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.

Component mounting apparatus and component mounting method

A component mounting apparatus includes a component feeder () that feeds a component () with its bump electrodes facing down, a mounting head () that mounts the component onto a substrate (), a supporting base () that secures the substrate, and a positioning device () that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (), an ultrasonic vibration propagation member () that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face () holding the component as vibration parallel thereto, a pressure loader () that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater () that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes () on its face.

Electronic component mounting method and apparatus and ultrasonic bonding head

Component () is pressed onto a circuit board () so that their respective metal interconnects (), () are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle () holding the component (). Friction is thereby generated between metal interconnects (), () whereby the component () is bonded on circuit substrate. Suction nozzle () for handling components is made of stainless steel and has a working face (a) provided with a hardened layer (b), or alternatively, suction nozzle () may have a suction head (c) having a working face (a) made of cemented carbide. Working face (a) of suction nozzle () is refined by polishing as required during the mounting operation.

Component mounting apparatus including a polishing device

Apparatus and method for mounting component

When pressurizing and relatively moving the objects to be bonded to each other relative to each other subject their metallic bonding portions to friction bonding for the friction bonding of the metallic bonding portions, the friction bonding operation is temporarily partway reduced or stopped.

Method and device for frictional connection and holding tool used for the frictional connection device

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Ibaraki, Japan

Shozo Minamitani